Light Emission from Silicon Nanostructures Produced by Conventional Lithographic and Reactive Ion Etching Techniques

Sub‐ten nanometer diameter silicon pillars and silicon walls of the same thickness are fabricated by using conventional optical lithography based on deep‐UV exposure and reactive ion etching using fluorine only containing gases. The produced structures are studied for their luminescence properties....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Physica status solidi. B. Basic research 1995-07, Vol.190 (1), p.91-95
Hauptverfasser: Nassiopoulos, A. G., Grigoropoulos, S., Papadimitriou, D., Gocolides, E.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Sub‐ten nanometer diameter silicon pillars and silicon walls of the same thickness are fabricated by using conventional optical lithography based on deep‐UV exposure and reactive ion etching using fluorine only containing gases. The produced structures are studied for their luminescence properties. Visible photoluminescence with a peak in the range 580 to 650 nm is observed under Ar laser irradiation.
ISSN:0370-1972
1521-3951
DOI:10.1002/pssb.2221900114