The Role of Interface Vibrational Modes in Thermal Boundary Resistance

Thermal Boundary Resistance Thermal boundary resistance is the largest impedance to heat transfer in many semiconductor devices. In article number 2100111, Christopher M. Stanley and co‐workers demonstrate using first‐principles simulations, that prevailing theory gives an incomplete picture of how...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Physica status solidi. A, Applications and materials science Applications and materials science, 2021-12, Vol.218 (23), p.n/a
Hauptverfasser:	Stanley, Christopher M., Rader, Benjamin K., Laster, Braxton H. D., Servati, Mahsa, Estreicher, Stefan K.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!