The Role of Interface Vibrational Modes in Thermal Boundary Resistance

Thermal Boundary Resistance Thermal boundary resistance is the largest impedance to heat transfer in many semiconductor devices. In article number 2100111, Christopher M. Stanley and co‐workers demonstrate using first‐principles simulations, that prevailing theory gives an incomplete picture of how heat is transferred at the interface. Unusually high‐frequency modes (≈850cm‐1) are found to carry 10% of the heat and reduce thermal boundary resistance by 26% at room temperature.