PCB implementation techniques and evaluations for 10 Gbit/s high-speed signal transmission

Conventionally, inner layer wires using via holes that have large losses are not intended for high‐speed electrical signal transmission in 10 Gbit/s printed‐circuit boards (using the 7‐GHz evaluation standard bandwidth), so only dedicated surface wires are used. However, surface wiring has a two‐dim...

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Veröffentlicht in:Electronics & communications in Japan. Part 2, Electronics Electronics, 2005-07, Vol.88 (7), p.39-49
Hauptverfasser: Toyoda, Hidehiro, Nishimura, Shinji, Kanai, Hisaaki, Kudou, Hitoshi, Tanaka, Harumitsu
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Sprache:eng
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Zusammenfassung:Conventionally, inner layer wires using via holes that have large losses are not intended for high‐speed electrical signal transmission in 10 Gbit/s printed‐circuit boards (using the 7‐GHz evaluation standard bandwidth), so only dedicated surface wires are used. However, surface wiring has a two‐dimensional wiring layout and is not suited to high‐density packaging. Therefore, to transmit high‐speed signals by using inner layer wiring that allows high‐density packaging, we designed and fabricated prototypes of extremely small via stub structures on a printed‐circuit board by using a low‐dielectric‐constant and low‐dielectric‐tangent material and quantitatively evaluated the improvement in the transmission losses. Our results showed that the use of a low‐dielectric‐constant and low‐dielectric‐tangent material can double the transmission distance to 130 mm (from about 60 mm using FR‐4 material). In addition, by using blind via holes and making the stubs as small as possible, via losses can be decreased by about 8 dB (for the 7‐GHz band and with stub length reduced from 1.89 to 0.25 mm) compared to through‐via holes. Based on this result, we demonstrated inner layer transmission of 10 Gbit/s signals in the board with high‐density packaging. © 2005 Wiley Periodicals, Inc. Electron Comm Jpn Pt 2, 88(7): 39–49, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecjb.20152
ISSN:8756-663X
1520-6432
DOI:10.1002/ecjb.20152