A new method of evaluation of the effect of electron beam and developing process on positive polymeric resists
A new method of evalution of the effect of electron beam on the latent changes in degrading polymer resists has been developed on the base of measurement of the developing curve under an interference microscope. An evalution procedure using the unit parameters (film thickness and development time) h...
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Veröffentlicht in: | J. Appl. Polym. Sci.; (United States) 1984-04, Vol.29 (4), p.1427-1432 |
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Sprache: | eng |
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