A new method of evaluation of the effect of electron beam and developing process on positive polymeric resists

A new method of evaluation of the effect of electron beam and developing process on positive polymeric resists

A new method of evalution of the effect of electron beam on the latent changes in degrading polymer resists has been developed on the base of measurement of the developing curve under an interference microscope. An evalution procedure using the unit parameters (film thickness and development time) h...

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Veröffentlicht in:J. Appl. Polym. Sci.; (United States) 1984-04, Vol.29 (4), p.1427-1432
Hauptverfasser: Pelzbauer, Z., Wagner, R.
Format: Artikel
Sprache:eng
Schlagworte:
360405 - Materials- Polymers & Plastics- Degradation & Erosion- (-1987)
400600 - Radiation Chemistry
Ageing
Applied sciences
BEAMS
CHEMICAL RADIATION EFFECTS
CHEMISTRY
DATA
DIMENSIONS
ELECTRON BEAMS
Exact sciences and technology
EXPERIMENTAL DATA
INFORMATION
IONIZING RADIATIONS
LEPTON BEAMS
MATERIALS SCIENCE
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PARTICLE BEAMS
Physical properties
Polymer industry, paints, wood
POLYMERS
Properties and testing
RADIATION CHEMISTRY
RADIATION CHEMISTRY, RADIOCHEMISTRY, AND NUCLEAR CHEMISTRY
RADIATION EFFECTS
RADIATIONS
SENSITIVITY
Technology of polymers
THICKNESS
TIME DEPENDENCE
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Beschreibung
Zusammenfassung:A new method of evalution of the effect of electron beam on the latent changes in degrading polymer resists has been developed on the base of measurement of the developing curve under an interference microscope. An evalution procedure using the unit parameters (film thickness and development time) has been suggested for the characterization of the sensitivity and contrast of resists.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.1984.070290435