Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

Fully 3D‐Printed, Ultrathin Capacitors via Multi‐Material Microsputtering

This study reports the first fully additively manufactured capacitors as a proof‐of‐concept demonstration of direct‐write, ultrathin‐film electronic components made via multi‐material microplasma sputtering. This is also the first demonstration of a cleanroom‐quality, multi‐material electrical devic...

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Veröffentlicht in:Advanced materials technologies 2022-08, Vol.7 (8), p.n/a
Hauptverfasser: Kornbluth, Yosef S., Parameswaran, Lalitha, Mathews, Richard, Racz, Livia M., Velásquez‐García, Luis F.
Format: Artikel
Sprache:eng
Schlagworte:
3D printing of electronics
alumina
heterogeneous dielectrics
microplasma sputtering
ultrathin films
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Zusammenfassung:This study reports the first fully additively manufactured capacitors as a proof‐of‐concept demonstration of direct‐write, ultrathin‐film electronic components made via multi‐material microplasma sputtering. This is also the first demonstration of a cleanroom‐quality, multi‐material electrical device produced entirely through additive manufacturing. Ultrathin metal and dielectric films are deposited at
ISSN:2365-709X
2365-709X
DOI:10.1002/admt.202200097