Decal Electronics: Printable Packaged with 3D Printing High‐Performance Flexible CMOS Electronic Systems

Decal Electronics: Printable Packaged with 3D Printing High‐Performance Flexible CMOS Electronic Systems

High‐performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll‐to‐roll fashion for highly manufacturable printed flexible high‐performance electronic systems.

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Bibliographische Detailangaben
Veröffentlicht in:Advanced materials technologies 2017-01, Vol.2 (1), p.n/a
Hauptverfasser: Sevilla, Galo A. Torres, Cordero, Marlon D., Nassar, Joanna M., Hanna, Amir N., Kutbee, Arwa T., Arevalo, Arpys, Hussain, Muhammad M.
Format: Artikel
Sprache:eng
Schlagworte:
3D printing
decal electronics
flexible CMOS electronics
inkjet
roll‐to‐roll printing
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Beschreibung
Zusammenfassung:High‐performance complementary metal oxide semiconductor electronics are flexed, packaged using 3D printing as decal electronics, and then printed in roll‐to‐roll fashion for highly manufacturable printed flexible high‐performance electronic systems.
ISSN:2365-709X
2365-709X
DOI:10.1002/admt.201600175