Cu Direct Nanopatterning Using Solid‐State Electrochemical Dissolution at the Anode/Polymer Electrolyte Membrane Interface (Adv. Mater. Interfaces 9/2024)

Solid‐State Electrochemical Etching In article 2300896, Junji Murata and co‐workers present an advanced, eco‐friendly electrochemical technique using a polymer electrolyte membrane stamp for high‐resolution copper patterning. This method eliminates liquid electrolytes, reducing environmental impact...

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Veröffentlicht in:Advanced materials interfaces 2024-03, Vol.11 (9), p.n/a
Hauptverfasser: Tsuji, Atsuki, Morimoto, Eita, Takizawa, Masaru, Murata, Junji
Format: Artikel
Sprache:eng
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Zusammenfassung:Solid‐State Electrochemical Etching In article 2300896, Junji Murata and co‐workers present an advanced, eco‐friendly electrochemical technique using a polymer electrolyte membrane stamp for high‐resolution copper patterning. This method eliminates liquid electrolytes, reducing environmental impact and enabling nanometer‐precision copper patterns without resists, marking a significant leap in electronic device manufacturing efficiency.
ISSN:2196-7350
2196-7350
DOI:10.1002/admi.202470024