Cu Direct Nanopatterning Using Solid‐State Electrochemical Dissolution at the Anode/Polymer Electrolyte Membrane Interface (Adv. Mater. Interfaces 9/2024)
Solid‐State Electrochemical Etching In article 2300896, Junji Murata and co‐workers present an advanced, eco‐friendly electrochemical technique using a polymer electrolyte membrane stamp for high‐resolution copper patterning. This method eliminates liquid electrolytes, reducing environmental impact...
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Veröffentlicht in: | Advanced materials interfaces 2024-03, Vol.11 (9), p.n/a |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | Solid‐State Electrochemical Etching
In article 2300896, Junji Murata and co‐workers present an advanced, eco‐friendly electrochemical technique using a polymer electrolyte membrane stamp for high‐resolution copper patterning. This method eliminates liquid electrolytes, reducing environmental impact and enabling nanometer‐precision copper patterns without resists, marking a significant leap in electronic device manufacturing efficiency. |
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ISSN: | 2196-7350 2196-7350 |
DOI: | 10.1002/admi.202470024 |