Rear‐Passivated Ultrathin Cu(In,Ga)Se 2 Films by Al 2 O 3 Nanostructures Using Glancing Angle Deposition Toward Photovoltaic Devices with Enhanced Efficiency
In this work, for the first time, the addition of aluminum oxide nanostructures (Al 2 O 3 NSs) grown by glancing angle deposition (GLAD) is investigated on an ultrathin Cu(In,Ga)Se 2 device (400 nm) fabricated using a sequential process, i.e., post‐selenization of the metallic precursor layer. The m...
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Veröffentlicht in: | Advanced functional materials 2019-11, Vol.29 (48) |
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Hauptverfasser: | , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | In this work, for the first time, the addition of aluminum oxide nanostructures (Al
2
O
3
NSs) grown by glancing angle deposition (GLAD) is investigated on an ultrathin Cu(In,Ga)Se
2
device (400 nm) fabricated using a sequential process, i.e., post‐selenization of the metallic precursor layer. The most striking observation to emerge from this study is the alleviation of phase separation after adding the Al
2
O
3
NSs with improved Se diffusion into the non‐uniformed metallic precursor due to the surface roughness resulting from the Al
2
O
3
NSs. In addition, the raised Na concentration at the rear surface can be attributed to the increased diffusion of Na ion facilitated by Al
2
O
3
NSs. The coverage and thickness of the Al
2
O
3
NSs significantly affects the cell performance because of an increase in shunt resistance associated with the formation of Na
2
Se
X
and phase separation. The passivation effect attributed to the Al
2
O
3
NSs is well studied using the bias‐EQE measurement and
J–V
characteristics under dark and illuminated conditions. With the optimization of the Al
2
O
3
NSs, the remarkable enhancement in the cell performance occurs, exhibiting a power conversion efficiency increase from 2.83% to 5.33%, demonstrating a promising method for improving ultrathin Cu(In,Ga)Se
2
devices, and providing significant opportunities for further applications. |
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ISSN: | 1616-301X 1616-3028 |
DOI: | 10.1002/adfm.201905040 |