Local Fatigue in Lead-Free SnAg3.8Cu0.7 Solder

It has been shown that in thin SnAg3.8Cu0.7 solder samples, strain concentration in shear bands is the dominant mechanism of fatigue damage. The development of degradation results from the interplay of lattice defect accumulation and recrystallization. Localized recrystallization is assumed to enhan...

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Veröffentlicht in:	Advanced engineering materials 2006-03, Vol.8 (3), p.179-183
Hauptverfasser:	Jud, P. P., Grossmann, G., Sennhauser, U., Uggowitzer, P. J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Exact sciences and technology Fatigue Lead-free Solders Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy
Online-Zugang:	Volltext
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Beschreibung
Zusammenfassung:	It has been shown that in thin SnAg3.8Cu0.7 solder samples, strain concentration in shear bands is the dominant mechanism of fatigue damage. The development of degradation results from the interplay of lattice defect accumulation and recrystallization. Localized recrystallization is assumed to enhance the lifetime of the samples. Line patterns superimposed by FIB are useful in tracking the deformation and in localizing slip planes in the solder.
ISSN:	1438-1656 1527-2648
DOI:	10.1002/adem.200500244