70-nm-gated InAIN/GaN HEMTs grown on SiC substrate with fT/fmax 〉 160 GHz

lnA1N/GaN high-electron-mobility transistors (HEMTs) on SiC substrate were fabricated and character- ized. Several techniques, consisting of high electron density, 70 nm T-shaped gate, low ohmic contacts and a short drain-source distance, are integrated to gain high device performance. The fabricate...

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Veröffentlicht in:半导体学报:英文版 2016 (2), p.86-89
1. Verfasser: 韩婷婷 敦少博 吕元杰 顾国栋 宋旭波 王元刚 徐鹏 冯志红
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Sprache:eng
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Zusammenfassung:lnA1N/GaN high-electron-mobility transistors (HEMTs) on SiC substrate were fabricated and character- ized. Several techniques, consisting of high electron density, 70 nm T-shaped gate, low ohmic contacts and a short drain-source distance, are integrated to gain high device performance. The fabricated InA1N/GaN HEMTs exhibit a maximum drain saturation current density of 1.65 A/ram at Vgs = 1 V and a maximum peak transconductance of 382 mS/rnm. In addition, a unity current gain cut-off frequency (fT) of 162 GHz and a maximum oscillation frequency (fmax) of 176 GHz are achieved on the devices with the 70 nm gate length.
ISSN:1674-4926