Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase（PTLP） Bonding with Multiple Interlayers

With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon（C/C） composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed t...

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Veröffentlicht in:	金属学报：英文版 2014 (4), p.663-669
1. Verfasser:	Xin Zhang Xiaohong Shi Jie Wang Hejun Li Kezhi Li Yancai Ren
Format:	Artikel
Sprache:	eng
Schlagworte:	复合材料 接头 显微组织 瞬间液相 粘合温度 金属间化合物层 键合技术 高温合金
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