Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase（PTLP） Bonding with Multiple Interlayers

With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon（C/C） composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer＇＇ were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.