Design and analysis of a highly-integrated CMOS power amplifier for RFID readers

To implement a fully-integrated on-chip CMOS power amplifier(PA) for RFID readers,the resonant frequency of each matching network is derived in detail.The highlight of the design is the adoption of a bonding wire as the output-stage inductor.Compared with the on-chip inductors in a CMOS process,the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of semiconductors 2009-06, Vol.30 (6), p.121-125
1. Verfasser: 高同强 张春 池保勇 王志华
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To implement a fully-integrated on-chip CMOS power amplifier(PA) for RFID readers,the resonant frequency of each matching network is derived in detail.The highlight of the design is the adoption of a bonding wire as the output-stage inductor.Compared with the on-chip inductors in a CMOS process,the merit of the bondwire inductor is its high quality factor,leading to a higher output power and efficiency.The disadvantage of the bondwire inductor is that it is hard to control.A highly integrated class-E PA is implemented with 0.18-μm CMOS process.It can provide a maximum output power of 20 dBm and a 1 dB output power of 14.5 dBm.The maximum power-added efficiency(PAE) is 32.1%.Also,the spectral performance of the PA is analyzed for the specified RFID protocol.
ISSN:1674-4926
DOI:10.1088/1674-4926/30/6/065008