Nitrogen Inerting Technology Can Lower Costs for Electronics Packaging and Assembly

Nitrogen Inerting Technology Can Lower Costs for Electronics Packaging and Assembly

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Veröffentlicht in:Advanced materials & processes 2011-06, Vol.169 (6), p.32-34
1. Verfasser: C. Christine Dong, Air Products and Chemicals Inc
Format: Magazinearticle
Sprache:eng
Schlagworte:
ASM and Affiliates
ASM Website
City of Materials
Elec Device Failure
Heat Treating
Industrial Design
Shape Memory
Thermal Spray
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issn 0882-7958
2161-9425
language eng
recordid cdi_asm_ampm_618605aa21b40310VgnVCM100000621e010aRCRD
source Alma/SFX Local Collection
subjects ASM and Affiliates
ASM Website
City of Materials
Elec Device Failure
Heat Treating
Industrial Design
Shape Memory
Thermal Spray
title Nitrogen Inerting Technology Can Lower Costs for Electronics Packaging and Assembly
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