3D Integration for VLSI Systems

3D Integration for VLSI Systems

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silico...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tan, Chuan Seng, Chen, Kuan-Neng, Koester, Steven J
Format: Buch
Sprache:eng
Schlagworte:
Integrated circuits
Physics
Very large scale integration
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Beschreibung
Zusammenfassung:Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.
DOI:10.1201/b11167