Time Dependent Dielectric Breakdown in 4H-SiC power MOSFETs under positive and negative gate-bias and gate-current stresses at 200{\deg}C
The gate oxide lifetime in 4H-SiC power MOSFETs is typically assessed at fixed and constant gate bias stress, monitoring the time-dependent dielectric breakdown (TDDB).
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Zusammenfassung: | The gate oxide lifetime in 4H-SiC power MOSFETs is typically assessed at
fixed and constant gate bias stress, monitoring the time-dependent dielectric
breakdown (TDDB). |
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DOI: | 10.48550/arxiv.2410.19545 |