Foundry's perspective on laser and SOA module integration with silicon photonics

Silicon photonic integrated circuit (PIC) builds on the demand for a low cost approach from established silicon-based manufacturing infrastructure traditionally built for electronics. Besides its natural abundance, silicon has desirable properties such as optically low loss (at certain critical wave...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:arXiv.org 2024-02
Hauptverfasser: Tan, James Y S, Shawn Xie Wu, Salih Yanikgonul, Li, Chao, Patrick Guo-Qiang Lo
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Silicon photonic integrated circuit (PIC) builds on the demand for a low cost approach from established silicon-based manufacturing infrastructure traditionally built for electronics. Besides its natural abundance, silicon has desirable properties such as optically low loss (at certain critical wavelengths), and small form factor to enable high density scaled-up optical on-chip circuitry. However, given its indirect bandgap, the platform is typically integrated with other direct bandgap (e.g., III-V semiconductor) platforms for on-chip light source. An effective solution to integrating light source onto silicon photonics platform is integral to a practical scaled-up and full-fledged integrated photonics implementation. Here, we discuss the integration solutions, and present our foundry's perspective toward realizing it.
ISSN:2331-8422
DOI:10.48550/arxiv.2405.01548