Lindblad Tomography of a Superconducting Quantum Processor
As progress is made towards the first generation of error-corrected quantum computers, robust characterization and validation protocols are required to assess the noise environments of physical quantum processors. While standard coherence metrics and characterization protocols such as T1 and T2, pro...
Gespeichert in:
Veröffentlicht in: | arXiv.org 2022-12 |
---|---|
Hauptverfasser: | , , , , , , , , , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | As progress is made towards the first generation of error-corrected quantum computers, robust characterization and validation protocols are required to assess the noise environments of physical quantum processors. While standard coherence metrics and characterization protocols such as T1 and T2, process tomography, and randomized benchmarking are now ubiquitous, these techniques provide only partial information about the dynamic multi-qubit loss channels responsible for processor errors, which can be described more fully by a Lindblad operator in the master equation formalism. Here, we introduce and experimentally demonstrate Lindblad tomography, a hardware-agnostic characterization protocol for tomographically reconstructing the Hamiltonian and Lindblad operators of a quantum noise environment from an ensemble of time-domain measurements. Performing Lindblad tomography on a small superconducting quantum processor, we show that this technique characterizes and accounts for state-preparation and measurement (SPAM) errors and allows one to place bounds on the fit to a Markovian model. Comparing the results of single- and two-qubit measurements on a superconducting quantum processor, we demonstrate that Lindblad tomography can also be used to identify and quantify sources of crosstalk on quantum processors, such as the presence of always-on qubit-qubit interactions. |
---|---|
ISSN: | 2331-8422 |
DOI: | 10.48550/arxiv.2105.02338 |