Hierarchical Current Density Verification for Electromigration Analysis in Arbitrary Shaped Metallization Patterns of Analog Circuits

Electromigration is caused by high current density stressin metallization patterns and is a major source of break-down in electronic devices. It is therefore an importantreliability issue to verify current densities within allstressed metallization patterns. In this paper we propose anew methodology...

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Bibliographische Detailangaben

Hauptverfasser:	Jerke, G., Lienig, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Hardware Hardware > Hardware validation
Online-Zugang:	Volltext
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