Hybrid systems-in-foil
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded...
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| Sprache: | English |
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Cambridge University Press
2021
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| Schriftenreihe: | Cambridge elements. Elements in flexible and large-area electronics
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| Online-Zugang: | Volltext |
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| 245 | 1 | 0 | |a Hybrid systems-in-foil |c Mourad Elsobky, Joachim N. Burghartz |
| 264 | 1 | |a Cambridge |b Cambridge University Press |c 2021 | |
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| 490 | 0 | |a Cambridge elements. Elements in flexible and large-area electronics |x 2398-4015 | |
| 520 | |a Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated. | ||
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Datensatz im Suchindex
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| id | ZDB-20-CTM-CR9781108985116 |
| illustrated | Not Illustrated |
| indexdate | 2024-12-18T12:04:27Z |
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| isbn | 9781108985116 |
| issn | 2398-4015 |
| language | English |
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| publishDate | 2021 |
| publishDateSearch | 2021 |
| publishDateSort | 2021 |
| publisher | Cambridge University Press |
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| series2 | Cambridge elements. Elements in flexible and large-area electronics |
| spelling | Elsobky, Mourad Hybrid systems-in-foil Mourad Elsobky, Joachim N. Burghartz Cambridge Cambridge University Press 2021 1 Online-Ressource (84 Seiten) txt c cr Cambridge elements. Elements in flexible and large-area electronics 2398-4015 Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated. Burghartz, Joachim N. Erscheint auch als Druck-Ausgabe 9781108984744 TUM01 ZDB-20-CTM TUM_PDA_CTM https://doi.org/10.1017/9781108985116 Volltext |
| spellingShingle | Elsobky, Mourad Hybrid systems-in-foil |
| title | Hybrid systems-in-foil |
| title_auth | Hybrid systems-in-foil |
| title_exact_search | Hybrid systems-in-foil |
| title_full | Hybrid systems-in-foil Mourad Elsobky, Joachim N. Burghartz |
| title_fullStr | Hybrid systems-in-foil Mourad Elsobky, Joachim N. Burghartz |
| title_full_unstemmed | Hybrid systems-in-foil Mourad Elsobky, Joachim N. Burghartz |
| title_short | Hybrid systems-in-foil |
| title_sort | hybrid systems in foil |
| url | https://doi.org/10.1017/9781108985116 |
| work_keys_str_mv | AT elsobkymourad hybridsystemsinfoil AT burghartzjoachimn hybridsystemsinfoil |