Harsh environment electronics interconnect materials and performance assessment
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barrie...
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| Format: | E-Book |
| Sprache: | English |
| Veröffentlicht: |
Weinheim, Germany
Wiley-VCH Verlag GmbH & Co.
[2019]
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| Online-Zugang: | Volltext |
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