Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
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| Format: | E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cambridge, UK
Woodhead Publishing
[2015]
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| Schriftenreihe: | Woodhead Publishing series in electronic and optical materials
number 81 |
| Online-Zugang: | Volltext |
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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
Veröffentlicht 2015
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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
Veröffentlicht 2015
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