Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
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| Format: | E-Book |
| Sprache: | English |
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Cambridge, UK
Woodhead Publishing
[2015]
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| Schriftenreihe: | Woodhead Publishing series in electronic and optical materials
number 81 |
| Online-Zugang: | Volltext |
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| 100 | 1 | |a Wong, E. -H. | |
| 245 | 1 | 0 | |a Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |c E.-H. Wong and Y.-W. Mai |
| 264 | 1 | |a Cambridge, UK |b Woodhead Publishing |c [2015] | |
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| spelling | Wong, E. -H. Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai Cambridge, UK Woodhead Publishing [2015] 1 Online-Ressource txt c cr Woodhead Publishing series in electronic and optical materials number 81 This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. -- Edited summary from book. Mai, Y. W. 1946- Erscheint auch als Druck-Ausgabe 9781845695286 TUM01 ZDB-10-ESC TUM_PDA_ESC https://app.knovel.com/hotlink/toc/id:kpRDMAAMS1/robust-design-of?kpromoter=marc Volltext |
| spellingShingle | Wong, E. -H Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_auth | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_exact_search | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_full | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
| title_fullStr | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
| title_full_unstemmed | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
| title_short | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_sort | robust design of microelectronics assemblies against mechanical shock temperature and moisture |
| url | https://app.knovel.com/hotlink/toc/id:kpRDMAAMS1/robust-design-of?kpromoter=marc |
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