Electronics Packaging Forum Volume Two
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and Unl...
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Dordrecht
Springer Netherlands
1991
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| Online-Zugang: | BTU01 URL des Erstveröffentlichers |
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| 520 | |a Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter | ||
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Datensatz im Suchindex
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:11:01Z |
| institution | BVB |
| isbn | 9789400904392 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030577394 |
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| physical | 1 Online-Ressource (VIII, 460 p) |
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| publishDate | 1991 |
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| publisher | Springer Netherlands |
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| spelling | Electronics Packaging Forum Volume Two edited by James E. Morris Dordrecht Springer Netherlands 1991 1 Online-Ressource (VIII, 460 p) txt rdacontent c rdamedia cr rdacarrier Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter Engineering Electronics and Microelectronics, Instrumentation Physics, general Physics Electronics Microelectronics Morris, James E. edt Erscheint auch als Druck-Ausgabe 9789401066815 https://doi.org/10.1007/978-94-009-0439-2 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Electronics Packaging Forum Volume Two Engineering Electronics and Microelectronics, Instrumentation Physics, general Physics Electronics Microelectronics |
| title | Electronics Packaging Forum Volume Two |
| title_auth | Electronics Packaging Forum Volume Two |
| title_exact_search | Electronics Packaging Forum Volume Two |
| title_full | Electronics Packaging Forum Volume Two edited by James E. Morris |
| title_fullStr | Electronics Packaging Forum Volume Two edited by James E. Morris |
| title_full_unstemmed | Electronics Packaging Forum Volume Two edited by James E. Morris |
| title_short | Electronics Packaging Forum |
| title_sort | electronics packaging forum volume two |
| title_sub | Volume Two |
| topic | Engineering Electronics and Microelectronics, Instrumentation Physics, general Physics Electronics Microelectronics |
| topic_facet | Engineering Electronics and Microelectronics, Instrumentation Physics, general Physics Electronics Microelectronics |
| url | https://doi.org/10.1007/978-94-009-0439-2 |
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