Design and modeling for 3D ICs and interposers
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the silicon via (TSV) and glass via (TGV) technology,...
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| 1. Verfasser: | |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Pub. Co.
c2014
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| Schriftenreihe: | WSPC series in advanced integration and packaging
v. 2 |
| Schlagworte: | |
| Online-Zugang: | DE-92 URL des Erstveroeffentlichers |
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