Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China
Gespeichert in:
Weitere Verfasser: | , , |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Dürnten, Switzerland ; Zurich, Switzerland
TTP
2014
|
Schriftenreihe: | Advanced Materials Research
Volume 905 |
Schlagworte: | |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
MARC
LEADER | 00000nmm a2200000zcb4500 | ||
---|---|---|---|
001 | BV044572277 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 171103s2014 |||| o||u| ||||||eng d | ||
020 | |a 9783038264392 |c ebook |9 978-3-03826-439-2 | ||
035 | |a (ZDB-30-PAD)EBC1910756 | ||
035 | |a (ZDB-89-EBL)EBL1910756 | ||
035 | |a (ZDB-38-EBR)ebr10868489 | ||
035 | |a (OCoLC)882251977 | ||
035 | |a (DE-599)BVBBV044572277 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
082 | 0 | |a 621.381028 |2 23 | |
245 | 1 | 0 | |a Advances in applied materials and electronics engineering III |b selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |c edited by Brendan Gan, Y. Gan and Y. Yu |
264 | 1 | |a Dürnten, Switzerland ; Zurich, Switzerland |b TTP |c 2014 | |
264 | 4 | |c © 2014 | |
300 | |a 1 online resource (804 pages) |b illustrations, tables | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Advanced Materials Research |v Volume 905 | |
500 | |a Description based on online resource; title from PDF title page (ebrary, viewed May 20, 2014) | ||
650 | 4 | |a Electronics |x Materials |v Congresses | |
650 | 4 | |a Materials science |v Congresses | |
655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
700 | 1 | |a Gan, Brendan |4 edt | |
700 | 1 | |a Gan, Y. |4 edt | |
700 | 1 | |a Yu, Y. |4 edt | |
710 | 2 | |a International Conference on Applied Materials and Electronics Engineering < 2014, Hong Kong, China> |e Sonstige |4 oth | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |t Advances in applied materials and electronics engineering III : selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |d Dürnten, Switzerland ; Zurich, Switzerland : TTP, c2014 |h 804 pages |k Advanced materials research ; Volume 905 |x 1662-8985 |z 9783038350583 |
912 | |a ZDB-30-PAD | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-029970798 |
Datensatz im Suchindex
_version_ | 1804177953014153216 |
---|---|
any_adam_object | |
author2 | Gan, Brendan Gan, Y. Yu, Y. |
author2_role | edt edt edt |
author2_variant | b g bg y g yg y y yy |
author_facet | Gan, Brendan Gan, Y. Yu, Y. |
building | Verbundindex |
bvnumber | BV044572277 |
collection | ZDB-30-PAD |
ctrlnum | (ZDB-30-PAD)EBC1910756 (ZDB-89-EBL)EBL1910756 (ZDB-38-EBR)ebr10868489 (OCoLC)882251977 (DE-599)BVBBV044572277 |
dewey-full | 621.381028 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381028 |
dewey-search | 621.381028 |
dewey-sort | 3621.381028 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02110nmm a2200421zcb4500</leader><controlfield tag="001">BV044572277</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">171103s2014 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038264392</subfield><subfield code="c">ebook</subfield><subfield code="9">978-3-03826-439-2</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PAD)EBC1910756</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-89-EBL)EBL1910756</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-38-EBR)ebr10868489</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)882251977</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044572277</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381028</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advances in applied materials and electronics engineering III</subfield><subfield code="b">selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China</subfield><subfield code="c">edited by Brendan Gan, Y. Gan and Y. Yu</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Dürnten, Switzerland ; Zurich, Switzerland</subfield><subfield code="b">TTP</subfield><subfield code="c">2014</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (804 pages)</subfield><subfield code="b">illustrations, tables</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Advanced Materials Research</subfield><subfield code="v">Volume 905</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Description based on online resource; title from PDF title page (ebrary, viewed May 20, 2014)</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials science</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gan, Brendan</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gan, Y.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Yu, Y.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">International Conference on Applied Materials and Electronics Engineering < 2014, Hong Kong, China></subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="t">Advances in applied materials and electronics engineering III : selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China</subfield><subfield code="d">Dürnten, Switzerland ; Zurich, Switzerland : TTP, c2014</subfield><subfield code="h">804 pages</subfield><subfield code="k">Advanced materials research ; Volume 905</subfield><subfield code="x">1662-8985</subfield><subfield code="z">9783038350583</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-30-PAD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029970798</subfield></datafield></record></collection> |
genre | (DE-588)1071861417 Konferenzschrift gnd-content |
genre_facet | Konferenzschrift |
id | DE-604.BV044572277 |
illustrated | Illustrated |
indexdate | 2024-07-10T07:56:15Z |
institution | BVB |
isbn | 9783038264392 |
issn | 1662-8985 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029970798 |
oclc_num | 882251977 |
open_access_boolean | |
physical | 1 online resource (804 pages) illustrations, tables |
psigel | ZDB-30-PAD |
publishDate | 2014 |
publishDateSearch | 2014 |
publishDateSort | 2014 |
publisher | TTP |
record_format | marc |
series2 | Advanced Materials Research |
spelling | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu Dürnten, Switzerland ; Zurich, Switzerland TTP 2014 © 2014 1 online resource (804 pages) illustrations, tables txt rdacontent c rdamedia cr rdacarrier Advanced Materials Research Volume 905 Description based on online resource; title from PDF title page (ebrary, viewed May 20, 2014) Electronics Materials Congresses Materials science Congresses (DE-588)1071861417 Konferenzschrift gnd-content Gan, Brendan edt Gan, Y. edt Yu, Y. edt International Conference on Applied Materials and Electronics Engineering < 2014, Hong Kong, China> Sonstige oth Erscheint auch als Druck-Ausgabe Advances in applied materials and electronics engineering III : selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China Dürnten, Switzerland ; Zurich, Switzerland : TTP, c2014 804 pages Advanced materials research ; Volume 905 1662-8985 9783038350583 |
spellingShingle | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China Electronics Materials Congresses Materials science Congresses |
subject_GND | (DE-588)1071861417 |
title | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
title_auth | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
title_exact_search | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
title_full | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu |
title_fullStr | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu |
title_full_unstemmed | Advances in applied materials and electronics engineering III selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China edited by Brendan Gan, Y. Gan and Y. Yu |
title_short | Advances in applied materials and electronics engineering III |
title_sort | advances in applied materials and electronics engineering iii selected peer reviewed papers from the 2014 3rd international conference on applied materials and electronics engineering amee 2014 april 26 27 2014 hong kong china |
title_sub | selected, peer reviewed papers from the 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014), April 26-27, 2014, Hong Kong, China |
topic | Electronics Materials Congresses Materials science Congresses |
topic_facet | Electronics Materials Congresses Materials science Congresses Konferenzschrift |
work_keys_str_mv | AT ganbrendan advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina AT gany advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina AT yuy advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina AT internationalconferenceonappliedmaterialsandelectronicsengineering2014hongkongchina advancesinappliedmaterialsandelectronicsengineeringiiiselectedpeerreviewedpapersfromthe20143rdinternationalconferenceonappliedmaterialsandelectronicsengineeringamee2014april26272014hongkongchina |