ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA
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| Format: | Elektronisch E-Book |
| Sprache: | English |
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Materials Park, OH
Asm International
c2008
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| LEADER | 00000nam a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV044189565 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 170220s2008 xx o|||| 00||| eng d | ||
| 020 | |a 0871707144 |9 0-87170-714-4 | ||
| 020 | |a 9780871707147 |9 978-0-87170-714-7 | ||
| 035 | |a (ZDB-30-PAD)EBC3002319 | ||
| 035 | |a (ZDB-89-EBL)EBL3002319 | ||
| 035 | |a (OCoLC)854633376 | ||
| 035 | |a (DE-599)BVBBV044189565 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 082 | 0 | |a 621.381 |2 23 | |
| 110 | 2 | |a International Symposium for Testing and Failure Analysis < 2008, Portland, Or.> |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a ISTFA 2008 |b conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA |c sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International |
| 246 | 1 | 3 | |a Proceedings of the 34th International Symposium for Testing and Failure Analysis |
| 246 | 1 | 3 | |a 34th International Symposium for Testing and Failure Analysis |
| 246 | 1 | 3 | |a Thirty-fourth International Symposium for Testing and Failure Analysis |
| 264 | 1 | |a Materials Park, OH |b Asm International |c c2008 | |
| 300 | |a xx, 528 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Electronics |x Materials |x Testing |v Congresses | |
| 650 | 4 | |a Electronic apparatus and appliances |x Testing |v Congresses | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 710 | 2 | |a ASM International |e Sonstige |4 oth | |
| 710 | 2 | |a Electronic Device Failure Analysis Society |e Sonstige |4 oth | |
| 912 | |a ZDB-30-PAD | ||
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-029596356 | |
Datensatz im Suchindex
| _version_ | 1819299839668649984 |
|---|---|
| any_adam_object | |
| author_corporate | International Symposium for Testing and Failure Analysis < 2008, Portland, Or.> |
| author_corporate_role | aut |
| author_facet | International Symposium for Testing and Failure Analysis < 2008, Portland, Or.> |
| author_sort | International Symposium for Testing and Failure Analysis < 2008, Portland, Or.> |
| building | Verbundindex |
| bvnumber | BV044189565 |
| collection | ZDB-30-PAD |
| ctrlnum | (ZDB-30-PAD)EBC3002319 (ZDB-89-EBL)EBL3002319 (OCoLC)854633376 (DE-599)BVBBV044189565 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01804nam a2200409zc 4500</leader><controlfield tag="001">BV044189565</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">170220s2008 xx o|||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0871707144</subfield><subfield code="9">0-87170-714-4</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780871707147</subfield><subfield code="9">978-0-87170-714-7</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PAD)EBC3002319</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-89-EBL)EBL3002319</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)854633376</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044189565</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="110" ind1="2" ind2=" "><subfield code="a">International Symposium for Testing and Failure Analysis < 2008, Portland, Or.></subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">ISTFA 2008</subfield><subfield code="b">conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA</subfield><subfield code="c">sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">Proceedings of the 34th International Symposium for Testing and Failure Analysis</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">34th International Symposium for Testing and Failure Analysis</subfield></datafield><datafield tag="246" ind1="1" ind2="3"><subfield code="a">Thirty-fourth International Symposium for Testing and Failure Analysis</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Materials Park, OH</subfield><subfield code="b">Asm International</subfield><subfield code="c">c2008</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xx, 528 p.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield><subfield code="x">Materials</subfield><subfield code="x">Testing</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="x">Testing</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">ASM International</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Electronic Device Failure Analysis Society</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-30-PAD</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029596356</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV044189565 |
| illustrated | Not Illustrated |
| indexdate | 2024-12-24T05:52:10Z |
| institution | BVB |
| isbn | 0871707144 9780871707147 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029596356 |
| oclc_num | 854633376 |
| open_access_boolean | |
| physical | xx, 528 p. |
| psigel | ZDB-30-PAD |
| publishDate | 2008 |
| publishDateSearch | 2008 |
| publishDateSort | 2008 |
| publisher | Asm International |
| record_format | marc |
| spelling | International Symposium for Testing and Failure Analysis < 2008, Portland, Or.> Verfasser aut ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International Proceedings of the 34th International Symposium for Testing and Failure Analysis 34th International Symposium for Testing and Failure Analysis Thirty-fourth International Symposium for Testing and Failure Analysis Materials Park, OH Asm International c2008 xx, 528 p. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Electronics Materials Testing Congresses Electronic apparatus and appliances Testing Congresses (DE-588)1071861417 Konferenzschrift gnd-content ASM International Sonstige oth Electronic Device Failure Analysis Society Sonstige oth |
| spellingShingle | ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA Electronics Materials Testing Congresses Electronic apparatus and appliances Testing Congresses |
| subject_GND | (DE-588)1071861417 |
| title | ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA |
| title_alt | Proceedings of the 34th International Symposium for Testing and Failure Analysis 34th International Symposium for Testing and Failure Analysis Thirty-fourth International Symposium for Testing and Failure Analysis |
| title_auth | ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA |
| title_exact_search | ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA |
| title_full | ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International |
| title_fullStr | ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International |
| title_full_unstemmed | ISTFA 2008 conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2008, ASM International |
| title_short | ISTFA 2008 |
| title_sort | istfa 2008 conference proceedings from the 34th international symposium for testing and failure analysis november 2 6 2008 oregon convention center portland oregon usa |
| title_sub | conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA |
| topic | Electronics Materials Testing Congresses Electronic apparatus and appliances Testing Congresses |
| topic_facet | Electronics Materials Testing Congresses Electronic apparatus and appliances Testing Congresses Konferenzschrift |
| work_keys_str_mv | AT internationalsymposiumfortestingandfailureanalysis2008portlandor istfa2008conferenceproceedingsfromthe34thinternationalsymposiumfortestingandfailureanalysisnovember262008oregonconventioncenterportlandoregonusa AT asminternational istfa2008conferenceproceedingsfromthe34thinternationalsymposiumfortestingandfailureanalysisnovember262008oregonconventioncenterportlandoregonusa AT electronicdevicefailureanalysissociety istfa2008conferenceproceedingsfromthe34thinternationalsymposiumfortestingandfailureanalysisnovember262008oregonconventioncenterportlandoregonusa AT internationalsymposiumfortestingandfailureanalysis2008portlandor proceedingsofthe34thinternationalsymposiumfortestingandfailureanalysis AT asminternational proceedingsofthe34thinternationalsymposiumfortestingandfailureanalysis AT electronicdevicefailureanalysissociety proceedingsofthe34thinternationalsymposiumfortestingandfailureanalysis AT internationalsymposiumfortestingandfailureanalysis2008portlandor 34thinternationalsymposiumfortestingandfailureanalysis AT asminternational 34thinternationalsymposiumfortestingandfailureanalysis AT electronicdevicefailureanalysissociety 34thinternationalsymposiumfortestingandfailureanalysis AT internationalsymposiumfortestingandfailureanalysis2008portlandor thirtyfourthinternationalsymposiumfortestingandfailureanalysis AT asminternational thirtyfourthinternationalsymposiumfortestingandfailureanalysis AT electronicdevicefailureanalysissociety thirtyfourthinternationalsymposiumfortestingandfailureanalysis |