Handbook of wafer bonding
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Weinheim, Germany
Wiley-VCH
2012
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| Schlagworte: | |
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MARC
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| 020 | |a 9783527326464 |9 978-3-527-32646-4 | ||
| 020 | |a 9783527644247 |c Online |9 978-3-527-64424-7 | ||
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| 245 | 1 | 0 | |a Handbook of wafer bonding |c edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| 264 | 1 | |a Weinheim, Germany |b Wiley-VCH |c 2012 | |
| 300 | |a xxxi, 395 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 505 | 0 | |a pt. 1. Technologies -- pt. 2. Applications | |
| 650 | 4 | |a Semiconductors |x Bonding |v Handbooks, manuals, etc | |
| 650 | 4 | |a Semiconductor wafers | |
| 650 | 4 | |a Microelectromechanical systems |x Design and construction | |
| 650 | 0 | 7 | |a MEMS |0 (DE-588)4824724-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wafer |0 (DE-588)4294605-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 0 | 1 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | 2 | |a MEMS |0 (DE-588)4824724-8 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Ramm, Peter |e Sonstige |4 oth | |
| 700 | 1 | |a Lu, James Jian-Qiang |e Sonstige |4 oth | |
| 700 | 1 | |a Taklo, Maaike M. V. |e Sonstige |4 oth | |
| 912 | |a ZDB-30-PAD | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029567163 | ||
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Datensatz im Suchindex
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|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV044160318 |
| collection | ZDB-30-PAD |
| contents | pt. 1. Technologies -- pt. 2. Applications |
| ctrlnum | (ZDB-30-PAD)EBC822735 (ZDB-89-EBL)EBL822735 (OCoLC)775301857 (DE-599)BVBBV044160318 |
| dewey-full | 621.38152 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.38152 |
| dewey-search | 621.38152 |
| dewey-sort | 3621.38152 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044160318 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:45:25Z |
| institution | BVB |
| isbn | 9783527326464 9783527644247 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029567163 |
| oclc_num | 775301857 |
| open_access_boolean | |
| physical | xxxi, 395 p. |
| psigel | ZDB-30-PAD |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | Wiley-VCH |
| record_format | marc |
| spelling | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo Weinheim, Germany Wiley-VCH 2012 xxxi, 395 p. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index pt. 1. Technologies -- pt. 2. Applications Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS (DE-588)4824724-8 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s MEMS (DE-588)4824724-8 s 1\p DE-604 Ramm, Peter Sonstige oth Lu, James Jian-Qiang Sonstige oth Taklo, Maaike M. V. Sonstige oth 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Handbook of wafer bonding pt. 1. Technologies -- pt. 2. Applications Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS (DE-588)4824724-8 gnd Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| subject_GND | (DE-588)4824724-8 (DE-588)4294605-0 (DE-588)4232594-8 |
| title | Handbook of wafer bonding |
| title_auth | Handbook of wafer bonding |
| title_exact_search | Handbook of wafer bonding |
| title_full | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| title_fullStr | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| title_full_unstemmed | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| title_short | Handbook of wafer bonding |
| title_sort | handbook of wafer bonding |
| topic | Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS (DE-588)4824724-8 gnd Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| topic_facet | Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS Wafer Bonden |
| work_keys_str_mv | AT rammpeter handbookofwaferbonding AT lujamesjianqiang handbookofwaferbonding AT taklomaaikemv handbookofwaferbonding |