Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
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| Format: | Elektronisch E-Book |
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| Sprache: | English |
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2015
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| Online-Zugang: | DE-1046 DE-703 Volltext Inhaltsverzeichnis Abstract |
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MARC
| LEADER | 00000nam a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV043309448 | ||
| 003 | DE-604 | ||
| 005 | 20160125 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 160125s2015 xx o|||| 00||| eng d | ||
| 020 | |a 9783319186757 |c Online |9 978-3-319-18675-7 | ||
| 024 | 7 | |a 10.1007/978-3-319-18675-7 |2 doi | |
| 035 | |a (OCoLC)934178874 | ||
| 035 | |a (DE-599)BVBBV043309448 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1046 |a DE-703 | ||
| 082 | 0 | |a 541.37 |2 23 | |
| 084 | |a ZN 5410 |0 (DE-625)157456: |2 rvk | ||
| 245 | 1 | 0 | |a Three-Dimensional Integration of Semiconductors |b Processing, Materials, and Applications |c Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed. |
| 264 | 1 | |a Cham |b Springer |c 2015 | |
| 300 | |a 1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 650 | 4 | |a Chemistry | |
| 650 | 4 | |a Electrochemistry | |
| 650 | 4 | |a Semiconductors | |
| 650 | 4 | |a Mechanical engineering | |
| 650 | 4 | |a Electrical engineering | |
| 650 | 4 | |a Biomedical engineering | |
| 650 | 4 | |a Electrical Engineering | |
| 650 | 4 | |a Mechanical Engineering | |
| 650 | 4 | |a Biomedical Engineering | |
| 650 | 4 | |a Chemie | |
| 700 | 1 | |a Kondo, Kazuo |e Sonstige |4 oth | |
| 700 | 1 | |a Kada, Morihiro |e Sonstige |4 oth | |
| 700 | 1 | |a Takahashi, Kenji |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druckausgabe |z 978-3-319-18674-0 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-319-18675-7 |x Verlag |3 Volltext |
| 856 | 4 | 2 | |m Springer Fremddatenuebernahme |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 856 | 4 | 2 | |m Springer Fremddatenuebernahme |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA |3 Abstract |
| 912 | |a ZDB-2-CMS | ||
| 940 | 1 | |q ZDB-2-CMS_2015 | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-028730137 | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-18675-7 |l DE-1046 |p ZDB-2-CMS |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-18675-7 |l DE-703 |p ZDB-2-CMS |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1819671825087463424 |
|---|---|
| adam_text | THREE-DIMENSIONAL INTEGRATION OF SEMICONDUCTORS
/
: 2015
TABLE OF CONTENTS / INHALTSVERZEICHNIS
RESEARCH AND DEVELOPMENT HISTORY OF THREE DIMENSIONAL (3D) INTEGRATION
TECHNOLOGY
RECENT RESEARCH AND DEVELOPMENT ACTIVITIES OF THREE DIMENSIONAL (3D)
INTEGRATION TECHNOLOGY
TSV PROCESSES
WAFER AND DIE BONDING PROCESSES
METROLOGY AND INSPECTION
TSV CHARACTERISTICS AND RELIABILITY: IMPACT OF 3D INTEGRATION PROCESSES
ON DEVICE RELIABILITY
TRENDS IN 3D INTEGRATED CIRCUIT (3D-IC) TESTING TECHNOLOGY
DREAM CHIP PROJECT AT ASET.
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
THREE-DIMENSIONAL INTEGRATION OF SEMICONDUCTORS
/
: 2015
ABSTRACT / INHALTSTEXT
THIS BOOK STARTS WITH BACKGROUNDCONCERNING THREE-DIMENSIONAL
INTEGRATION - INCLUDING THEIRLOW ENERGY CONSUMPTION AND HIGH SPEED
IMAGE PROCESSING - AND THEN PROCEEDS TO HOW TO CONSTRUCT THEM AND WHICH
MATERIALS TO USE IN PARTICULAR SITUATIONS.THE BOOK COVERS NUMEROUS
APPLICATIONS, INCLUDINGNEXT GENERATION SMART PHONES, DRIVING
ASSISTANCE SYSTEMS, CAPSULE ENDOSCOPES, HOMING MISSILES, AND MANY
OTHERS. THE BOOK CONCLUDES WITH RECENT PROGRESS AND DEVELOPMENTS IN
THREE DIMENSIONAL PACKAGING, AS WELL AS FUTURE PROSPECTS
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
|
| any_adam_object | 1 |
| building | Verbundindex |
| bvnumber | BV043309448 |
| classification_rvk | ZN 5410 |
| collection | ZDB-2-CMS |
| ctrlnum | (OCoLC)934178874 (DE-599)BVBBV043309448 |
| dewey-full | 541.37 |
| dewey-hundreds | 500 - Natural sciences and mathematics |
| dewey-ones | 541 - Physical chemistry |
| dewey-raw | 541.37 |
| dewey-search | 541.37 |
| dewey-sort | 3541.37 |
| dewey-tens | 540 - Chemistry and allied sciences |
| discipline | Chemie / Pharmazie Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-3-319-18675-7 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02309nam a2200529zc 4500</leader><controlfield tag="001">BV043309448</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20160125 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">160125s2015 xx o|||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319186757</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-319-18675-7</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-319-18675-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)934178874</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043309448</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield><subfield code="a">DE-703</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">541.37</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 5410</subfield><subfield code="0">(DE-625)157456:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Three-Dimensional Integration of Semiconductors</subfield><subfield code="b">Processing, Materials, and Applications</subfield><subfield code="c">Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer</subfield><subfield code="c">2015</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrochemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Biomedical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Biomedical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemie</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kondo, Kazuo</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kada, Morihiro</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Takahashi, Kenji</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druckausgabe</subfield><subfield code="z">978-3-319-18674-0</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-319-18675-7</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Abstract</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-CMS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-CMS_2015</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-028730137</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-18675-7</subfield><subfield code="l">DE-1046</subfield><subfield code="p">ZDB-2-CMS</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-18675-7</subfield><subfield code="l">DE-703</subfield><subfield code="p">ZDB-2-CMS</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV043309448 |
| illustrated | Not Illustrated |
| indexdate | 2024-12-24T04:50:46Z |
| institution | BVB |
| isbn | 9783319186757 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028730137 |
| oclc_num | 934178874 |
| open_access_boolean | |
| owner | DE-1046 DE-703 |
| owner_facet | DE-1046 DE-703 |
| physical | 1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color) |
| psigel | ZDB-2-CMS ZDB-2-CMS_2015 |
| publishDate | 2015 |
| publishDateSearch | 2015 |
| publishDateSort | 2015 |
| publisher | Springer |
| record_format | marc |
| spellingShingle | Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie |
| title | Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications |
| title_auth | Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications |
| title_exact_search | Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications |
| title_full | Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed. |
| title_fullStr | Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed. |
| title_full_unstemmed | Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed. |
| title_short | Three-Dimensional Integration of Semiconductors |
| title_sort | three dimensional integration of semiconductors processing materials and applications |
| title_sub | Processing, Materials, and Applications |
| topic | Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie |
| topic_facet | Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie |
| url | https://doi.org/10.1007/978-3-319-18675-7 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT kondokazuo threedimensionalintegrationofsemiconductorsprocessingmaterialsandapplications AT kadamorihiro threedimensionalintegrationofsemiconductorsprocessingmaterialsandapplications AT takahashikenji threedimensionalintegrationofsemiconductorsprocessingmaterialsandapplications |