RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

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Bibliographische Detailangaben
1. Verfasser: Kuang, Ken (VerfasserIn)
Format: Elektronisch E-Book
Sprache:English
Veröffentlicht: Boston, MA Springer US 2010
Schlagworte:
Engineering
Microwaves
Electronics
Systems engineering
Electronics and Microelectronics, Instrumentation
Microwaves, RF and Optical Engineering
Circuits and Systems
Ingenieurwissenschaften
Elektronisches Bauelement
Gehäuse
Online-Zugang:DE-634
DE-573
DE-92
DE-898
Volltext
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Inhaltsangabe:
  • Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
  • Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
  • Polymeric Microelectromechanical Millimeter Wave Systems
  • Millimeter-Wave Chip-on-Board Integration and Packaging
  • Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
  • RF/Microwave Substrate Packaging Roadmap for Portable Devices
  • Ceramic Systems in Package for RF and Microwave
  • Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
  • LTCC Substrates for RF/MW Application
  • High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
  • High Performance Microelectronics Packaging Heat Sink Materials
  • Technology Research on AlN 3D MCM.

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