Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling
Preface; Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2....
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| Format: | Elektronisch E-Book |
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| Sprache: | English |
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World Scientific Publishing Company
2012
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| 245 | 1 | 0 | |a Encyclopedia of Thermal Packaging - Set 1 |b Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling |c Editor-in-Chief Avram Bar-Cohen |
| 264 | 1 | |a Singapore |b World Scientific Publishing Company |c 2012 | |
| 300 | |a Online-Ressource (1 online resource (1582 p.)) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Description based upon print version of record | ||
| 520 | |a Preface; Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management | ||
| 520 | |a 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance | ||
| 520 | |a 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References | ||
| 600 | 3 | 4 | |a Electronic books |
| 650 | 4 | |a Adhesives / Electric properties | |
| 650 | 4 | |a Electronic packaging | |
| 650 | 4 | |a Microelectronic packaging | |
| 650 | 4 | |a Nanostructured materials | |
| 700 | 1 | |a Bar-Cohen, Avram |e Sonstige |4 oth | |
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Datensatz im Suchindex
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| bvnumber | BV041656647 |
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| ctrlnum | (OCoLC)874417301 (DE-599)BSZ381318893 |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV041656647 |
| illustrated | Not Illustrated |
| indexdate | 2024-12-24T04:01:49Z |
| institution | BVB |
| isbn | 9789814313803 9781628700992 |
| language | English |
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| spelling | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling Editor-in-Chief Avram Bar-Cohen Singapore World Scientific Publishing Company 2012 Online-Ressource (1 online resource (1582 p.)) txt rdacontent c rdamedia cr rdacarrier Description based upon print version of record Preface; Foreword to the Encyclopedia of Thermal Packaging by Wataru Nakayama; Contents; Chapter 1 Introduction; 1.1. Physics and Applications of Microchannels; 1.2. Use of Microchannels in Electronics Cooling; References; Chapter 2 Design and Optimization of Single-Phase Microchannel Heat Sinks; 2.1. Prediction of Heat Transfer Coefficient; 2.1.1. Experiments and comparison to correlations; 2.1.2. Numerical analyses; 2.1.3. Correlations; 2.2. Prediction of Pressure Drop; 2.3. Optimization of Heat Transfer Performance; 2.4. Importance of Inlet Manifold Design; 2.5. Hot-Spot Thermal Management 2.6. System-Level Design and OptimizationReferences; Chapter 3 Two-Phase Operation of Microchannel Heat Sinks; 3.1. Fundamentals of Two-Phase Transport in Microchannels; 3.2. Macroscale versus Microscale Boiling; 3.3. Flow Regime Maps; References; Chapter 4 Boiling Heat Transfer at Small Scales; 4.1. Saturated Boiling in Microchannels; 4.2. Heat Transfer in Boiling and Two-Phase Flow; 4.3. Effect of Geometrical and Flow Parameters; 4.3.1. Effect of channel dimensions; 4.3.2. Effect of mass flow rate; 4.3.3. Effect of surface roughness; 4.4. Empirical Predictions of Thermal Performance 4.4.1. Subcooled boiling regime4.4.2. Saturated boiling regime; 4.4.3. Saturated flow boiling correlation; 4.5. Physics-Based Modeling of Boiling Heat Transfer; 4.5.1. Annular flow; 4.5.1.1. Solution procedure; 4.5.1.2. Model assessment; 4.5.2. Annular/Wispy-annular flow; 4.5.3. Slug flow; References; Chapter 5 Pressure Drop in Two-Phase Flow; 5.1. Two-Phase Flow Pressure Drop; 5.2. Empirical Prediction of Two-Phase Pressure Drop; 5.3. Regime-Based Modeling of Two-Phase Pressure Drop; 5.3.1. Confined flow; 5.3.2. Unconfined flow; 5.3.3. Model assessment; References Electronic books Adhesives / Electric properties Electronic packaging Microelectronic packaging Nanostructured materials Bar-Cohen, Avram Sonstige oth http://app.knovel.com/web/toc.v/cid:kpETPSTPT5/viewerType:toc/root_slug:encyclopedia-thermal Volltext |
| spellingShingle | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling Electronic books Adhesives / Electric properties Electronic packaging Microelectronic packaging Nanostructured materials |
| title | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling |
| title_auth | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling |
| title_exact_search | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling |
| title_full | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling Editor-in-Chief Avram Bar-Cohen |
| title_fullStr | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling Editor-in-Chief Avram Bar-Cohen |
| title_full_unstemmed | Encyclopedia of Thermal Packaging - Set 1 Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling Editor-in-Chief Avram Bar-Cohen |
| title_short | Encyclopedia of Thermal Packaging - Set 1 |
| title_sort | encyclopedia of thermal packaging set 1 thermal packaging techniques volumes 1 6 microchannel heat sinks for electronics cooling |
| title_sub | Thermal Packaging Techniques ; Volumes 1 - 6 ; Microchannel Heat Sinks for Electronics Cooling |
| topic | Electronic books Adhesives / Electric properties Electronic packaging Microelectronic packaging Nanostructured materials |
| topic_facet | Electronic books Adhesives / Electric properties Electronic packaging Microelectronic packaging Nanostructured materials |
| url | http://app.knovel.com/web/toc.v/cid:kpETPSTPT5/viewerType:toc/root_slug:encyclopedia-thermal |
| work_keys_str_mv | AT barcohenavram encyclopediaofthermalpackagingset1thermalpackagingtechniquesvolumes16microchannelheatsinksforelectronicscooling |