Practical guide to the packaging of electronics thermal and mechanical design and analysis

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1. Verfasser: Jamnia, Ali 1961- (VerfasserIn)
Format: Buch
Sprache:English
Veröffentlicht: Boca Raton CRC Press, Taylor & Francis 2009
Ausgabe:2nd ed.
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Datensatz im Suchindex

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author Jamnia, Ali 1961-
author_GND (DE-588)1164169270
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discipline Elektrotechnik / Elektronik / Nachrichtentechnik
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spelling Jamnia, Ali 1961- Verfasser (DE-588)1164169270 aut
Practical guide to the packaging of electronics thermal and mechanical design and analysis Ali Jamnia
2nd ed.
Boca Raton CRC Press, Taylor & Francis 2009
XXI, 308 S. Ill., graph. Darst.
txt rdacontent
n rdamedia
nc rdacarrier
Electronic packaging
Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf
Gehäuse (DE-588)4156307-4 gnd rswk-swf
Gehäuse (DE-588)4156307-4 s
Elektronisches Bauelement (DE-588)4014360-0 s
DE-604
http://www.loc.gov/catdir/toc/ecip0828/2008040769.html Table of contents only
spellingShingle Jamnia, Ali 1961-
Practical guide to the packaging of electronics thermal and mechanical design and analysis
Electronic packaging
Elektronisches Bauelement (DE-588)4014360-0 gnd
Gehäuse (DE-588)4156307-4 gnd
subject_GND (DE-588)4014360-0
(DE-588)4156307-4
title Practical guide to the packaging of electronics thermal and mechanical design and analysis
title_auth Practical guide to the packaging of electronics thermal and mechanical design and analysis
title_exact_search Practical guide to the packaging of electronics thermal and mechanical design and analysis
title_full Practical guide to the packaging of electronics thermal and mechanical design and analysis Ali Jamnia
title_fullStr Practical guide to the packaging of electronics thermal and mechanical design and analysis Ali Jamnia
title_full_unstemmed Practical guide to the packaging of electronics thermal and mechanical design and analysis Ali Jamnia
title_short Practical guide to the packaging of electronics
title_sort practical guide to the packaging of electronics thermal and mechanical design and analysis
title_sub thermal and mechanical design and analysis
topic Electronic packaging
Elektronisches Bauelement (DE-588)4014360-0 gnd
Gehäuse (DE-588)4156307-4 gnd
topic_facet Electronic packaging
Elektronisches Bauelement
Gehäuse
url http://www.loc.gov/catdir/toc/ecip0828/2008040769.html
work_keys_str_mv AT jamniaali practicalguidetothepackagingofelectronicsthermalandmechanicaldesignandanalysis