Ultra-thin Chip Technology and Applications

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Veröffentlicht: New York, NY Springer New York 2011
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indexdate 2024-08-01T11:46:37Z
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isbn 9781441972767
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spellingShingle Ultra-thin Chip Technology and Applications
Ingenieurwissenschaften
Engineering
Computer aided design
Systems engineering
Circuits and Systems
Computer-Aided Engineering (CAD, CAE) and Design
title Ultra-thin Chip Technology and Applications
title_auth Ultra-thin Chip Technology and Applications
title_exact_search Ultra-thin Chip Technology and Applications
title_full Ultra-thin Chip Technology and Applications edited by Joachim Burghartz
title_fullStr Ultra-thin Chip Technology and Applications edited by Joachim Burghartz
title_full_unstemmed Ultra-thin Chip Technology and Applications edited by Joachim Burghartz
title_short Ultra-thin Chip Technology and Applications
title_sort ultra thin chip technology and applications
topic Ingenieurwissenschaften
Engineering
Computer aided design
Systems engineering
Circuits and Systems
Computer-Aided Engineering (CAD, CAE) and Design
topic_facet Ingenieurwissenschaften
Engineering
Computer aided design
Systems engineering
Circuits and Systems
Computer-Aided Engineering (CAD, CAE) and Design
url https://doi.org/10.1007/978-1-4419-7276-7
work_keys_str_mv AT burghartzjoachim ultrathinchiptechnologyandapplications
AT springerlinkonlineservice ultrathinchiptechnologyandapplications