RF and microwave microelectronics packaging

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Bibliographische Detailangaben
Weitere Verfasser: Kuang, Ken (HerausgeberIn)
Format: Buch
Sprache:English
Veröffentlicht: New York [u.a.] Springer 2010
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MARC

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Datensatz im Suchindex

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ctrlnum (OCoLC)552167543
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dewey-hundreds 600 - Technology (Applied sciences)
dewey-ones 621 - Applied physics
dewey-raw 621.381046
dewey-search 621.381046
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dewey-tens 620 - Engineering and allied operations
discipline Maschinenbau / Maschinenwesen
Elektrotechnik / Elektronik / Nachrichtentechnik
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physical XVI, 285 S. Ill., graph. Darst.
publishDate 2010
publishDateSearch 2010
publishDateSort 2010
publisher Springer
record_format marc
spelling RF and microwave microelectronics packaging Ken Kuang ..., ed.
New York [u.a.] Springer 2010
XVI, 285 S. Ill., graph. Darst.
txt rdacontent
n rdamedia
nc rdacarrier
Gehäuse (DE-588)4156307-4 gnd rswk-swf
Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf
Elektronisches Bauelement (DE-588)4014360-0 s
Gehäuse (DE-588)4156307-4 s
DE-604
Kuang, Ken edt
Erscheint auch als Online-Ausgabe 978-1-4419-0984-8
http://digitool.hbz-nrw.de:1801/webclient/DeliveryManager?pid=3697059&custom_att_2=simple_viewer Verlagsdaten Springer RF and microwave microelectronics packaging
spellingShingle RF and microwave microelectronics packaging
Gehäuse (DE-588)4156307-4 gnd
Elektronisches Bauelement (DE-588)4014360-0 gnd
subject_GND (DE-588)4156307-4
(DE-588)4014360-0
title RF and microwave microelectronics packaging
title_auth RF and microwave microelectronics packaging
title_exact_search RF and microwave microelectronics packaging
title_full RF and microwave microelectronics packaging Ken Kuang ..., ed.
title_fullStr RF and microwave microelectronics packaging Ken Kuang ..., ed.
title_full_unstemmed RF and microwave microelectronics packaging Ken Kuang ..., ed.
title_short RF and microwave microelectronics packaging
title_sort rf and microwave microelectronics packaging
topic Gehäuse (DE-588)4156307-4 gnd
Elektronisches Bauelement (DE-588)4014360-0 gnd
topic_facet Gehäuse
Elektronisches Bauelement
url http://digitool.hbz-nrw.de:1801/webclient/DeliveryManager?pid=3697059&custom_att_2=simple_viewer
work_keys_str_mv AT kuangken rfandmicrowavemicroelectronicspackaging