Lecture notes on principles of plasma processing

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Hauptverfasser: Chen, Francis F. 1929- (VerfasserIn), Chang, Jane P. (VerfasserIn)
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Sprache:English
Veröffentlicht: New York Springer 2003
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adam_text LECTURE NOTES ON PRINCIPLES OF PLASMA PROCESSING FRANCIS F. CHEN ELECTRICAL ENGINEERING DEPARTMENT AND JANE P. CHANG CHEMICAL ENGINEERING DEPARTMENT UNIVERSITY OF CALIFORNIA LOS ANGELES, CALIFORNIA KLUWER ACADEMIC / PLENUM PUBLISHERS NEW YORK, BOSTON, DORDRECHT, LONDON, MOSCOW TABLE OF CONTENTS VLL TABLE OF PLASMA PHYSICS PART AL: INTRODUCTION TO PLASMA SCIENCE I. WHAT IS A PLASMA? 1 II. PLASMA FUNDAMENTALS 3 1. QUASINEUTRALITY AND DEBYE LENGTH 2. PLASMA FREQUENCY AND ACOUSTIC VELOCITY 3. LARMOR RADIUS AND CYCLOTRON FREQUENCY 4. E X * DRIFT 5. SHEATHS AND PRESHEATHS PART A2: INTRODUCTION TO GAS DISCHARGES HI. GAS DISCHARGE FUNDAMENTALS 11 1. COLLISION CROSS SECTION AND MEAN FREE PATH 2. IONIZATION AND EXCITATION CROSS SECTIONS 3. COULOMB COLLISIONS; RESISTIVITY 4. TRANSITION BETWEEN NEUTRAL- AND ION- DOMINATED ELECTRON COLLISIONS 5. MOBILITY, DIFFUSION, AMBIPOLAR DIFFUSION 6. MAGNETIC FIELD EFFECTS; MAGNETIC BUCKETS CROSS SECTION DATA 21 PART A3: PLASMA SOURCES I IV. INTRODUCTION TO PLASMA SOURCES 25 1. DESIRABLE CHARACTERISTICS OF PLASMA PROCESSING SOURCES 2. ELEMENTS OF A PLASMA SOURCE PART A4: PLASMA SOURCES II V. RLE DISCHARGES 31 1. DEBYE SHEATH 2. CHILD-LANGMUIR SHEATH 3. APPLYING A DC BIAS 4. APPLYING AN RF BIAS 5. DISPLACEMENT CURRENT 6. ION DYNAMICS IN THE SHEATH 7. OTHER EFFECTS IN RIE REACTORS 8. DISADVANTAGES OF RIE REACTORS 9. MODIFIED RIE DEVICES PLASMA CHEMISTRY PART BL : OVERVIEW OF PLASMA PROCESSING IN MICROELECTRONICS FABRICATION I. PLASMA PROCESSING 99 II. APPLICATIONS IN MICROELECTRONICS 100 PART B2: KINETIC THEORY AND COLLISIONS I. KINETIC THEORY 103 II. PRACTICAL GAS KINETIC MODELS AND MACROSCOPIC PROPERTIES 109 1. MAXWELL-BOLTZMANN DISTRIBUTION (MBD) 2. A SIMPLIFIED GAS MODEL (SGM) 3. ENERGY CONTENT 4. COLLISION RATE BETWEEN MOLECULES 5. MEAN FREE PATH 6. FLUX OF GAS PARTICLES ON A SURFACE 7. GAS PRESSURE 8. TRANSPORT PROPERTIES 9. GAS FLOW III. COLLISION DYNAMICS 119 1. COLLISION CROSS SECTIONS 2. ENERGY TRANSFER 3. INELASTIC COLLISIONS PART B3: ATOMIC COLLISIONS AND SPECTRA I. ATOMIC ENERGY LEVELS 125 II. ATOMIC COLLISIONS 126 1. EXCITATION PROCESSES 2. RELAXATION AND RECOMBINATION PROCESSES III. ELASTIC COLLISIONS 129 1. COULOMB COLLISIONS 2. POLARIZATION SCATTERING IV. INELASTIC COLLISIONS 130 1. CONSTRAINTS ON ELECTRONIC TRANSITIONS 2. IDENTIFICATION OF ATOMIC SPECTRA 3. A SIMPLIFIED MODEL VLLL TABLE OF CONTENTS PART A5: PLASMA SOURCES III VI. ECR SOURCES 47 VII. INDUCTIVELY COUPLED PLASMAS (ICPS) 49 1. OVERVIEW OF ICPS 2. NORMAL SKIN DEPTH 3. ANOMALOUS SKIN DEPTH 4. IONIZATION ENERGY 5. TRANSFORMER COUPLED PLASMAS (TCPS) 6. MATCHING CIRCUITS 7. ELECTROSTATIC CHUCKS (ESCS) PART A6: PLASMA SOURCES IV VIII. HELICON WAVE SOURCES AND HDPS 61 1. DISPERSION RELATION 2. WAVE PATTERNS AND ANTENNAS 3. MODE JUMPING 4. MODIFIED SKIN DEPTH 5. TRIVELPIECE-GOULD MODES 6. EXAMPLES OF HELICON MEASUREMENTS 7. COMMERCIAL HELICON SOURCES IX. DISCHARGE EQUILIBRIUM 69 1. PARTICLE BALANCE 2. ENERGY BALANCE 3. ELECTRON TEMPERATURE 4. ION TEMPERATURE PART A7: PLASMA DIAGNOSTICS X. INTRODUCTION 75 XI. REMOTE DIAGNOSTICS 75 1. OPTICAL SPECTROSCOPY 2. MICROWAVE INTERFEROMETRY 3. LASER INDUCED FLUORESCENCE (LIF) XII. LANGMUIR PROBES 79 1. CONSTRUCTION AND CIRCUIT 2. THE ELECTRON CHARACTERISTIC 3. ELECTRON SATURATION 4. SPACE POTENTIAL 5. ION SATURATION CURRENT 83 6. DISTRIBUTION FUNCTIONS 90 7. RF COMPENSATION 8. DOUBLE PROBES AND HOT PROBES PART B4: MOLECULAR COLLISIONS AND SPECTRA I. MOLECULAR ENERGY LEVELS 137 1. ELECTRONIC ENERGY LEVEL 2. VIBRATIONAL ENERGY LEVEL 3. ROTATIONAL ENERGY LEVEL II. SELECTION RULE FOR OPTICAL EMISSION OF MOLECULES 139 III. ELECTRON COLLISIONS WITH MOLECULES 140 1. FRANK-CONDON PRINCIPLE 2. DISSOCIATION 3. DISSOCIATIVE IONIZATION 4. DISSOCIATIVE RECOMBINATION 5. DISSOCIATIVE ELECTRON ATTACHMENT 6. ELECTRON IMPACT DETACHMENT 7. VIBRATIONAL AND ROTATIONAL EXCITATION IV. HEAVY PARTICLE COLLISIONS 142 V. GAS PHASE KINETICS 143 PART B5: PLASMA DIAGNOSTICS I. OPTICAL EMISSION SPECTROSCOPY 151 1. OPTICAL EMISSION 2. SPECTROSCOPY 3. ACTINOMETRY 4. ADVANTAGES/DISADVANTAGES 5. APPLICATION: END-POINT DETECTION II. LASER INDUCED FLUORESCENCE 161 HI. LASER INTERFEROMETRY 162 IV. FULL-WAFER INTERFEROMETRY 163 V. MASS SPECTROMETRY 164 PART B6: PLASMA SURFACE KINETICS I. PLASMA CHEMISTRY 167 II. SURFACE REACTIONS 167 1. SPONTANEOUS SURFACE ETCHING 2. SPONTANEOUS DEPOSITION 3. ION SPUTTERING KINETICS 4. ION-ENHANCED CHEMICAL ETCHING HI. LOADING 777 IV. SELECTIVITY 178 V. DETAILED REACTION MODELING / 79 TABLE OF CONTENTS IX XIII. OTHER LOCAL DIAGNOSTICS 93 1. MAGNETIC PROBES 2. ENERGY ANALYZERS 3. RF CURRENT PROBE 4. PLASMA OSCILLATION PROBE I. II. PART B7: FEATURE EVOLUTION AND MODELING FUNDAMENTALS OF FEATURE EVOLUTION IN PLASMA ETCHING 183 PREDICTIVE MODELING 185 186 III. MECHANISMS OF PROFILE EVOLUTION 1. ION BOMBARDMENT DIRECTIONALITY 2. ION SCATTERING WITHIN THE FEATURE 3. DEPOSITION RATE OF PASSIVANTS 4. LINE-OF-SIGHT REDEPOSITION OF PRODUCTS 5. CHARGING OF SURFACES IN THE FEATURES IV. PROFILE SIMULATION 190 V. PLASMA DAMAGE 193 1. CONTAMINATION 2. PARTICULATES 3. GATE OXIDE DAMAGE - PHOTON 4. GATE OXIDE DAMAGE - ELECTRICAL STRESS 5. LATTICE DAMAGE 6. POST-ETCH CORROSION EPILOGUE: CURRENT PROBLEMS IN SEMICONDUCTOR PROCESSING I. FRONT-END CHALLENGES 199 1. HIGH-K DIELECTRICS 2. METAL GATES II. BACK-END CHALLENGES 201 1. COPPER METALLLIZATION 2. INTERLAYER DIELECTRICS (ILDS) 3. BARRIER MATERIALS III. PATTERNING NANOMETER FEATURES 204 1. E-BEAM 2. RESIST TRIMMING IV. DEEP REACTIVE ETCH FOR MEMS 205 V. PLASMA-INDUCED DAMAGE 206 VI. SPECIES CONTROL IN PLASMA REACTORS 207 199
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Lecture notes on principles of plasma processing Francis F. Chen and Jane P. Chang
New York Springer 2003
IX, 208 S. Ill., graph. Darst. 1 CD-ROM
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spellingShingle Chen, Francis F. 1929-
Chang, Jane P.
Lecture notes on principles of plasma processing
Plasmaphysik (DE-588)4046259-6 gnd
Plasmatechnik (DE-588)4140353-8 gnd
subject_GND (DE-588)4046259-6
(DE-588)4140353-8
title Lecture notes on principles of plasma processing
title_auth Lecture notes on principles of plasma processing
title_exact_search Lecture notes on principles of plasma processing
title_full Lecture notes on principles of plasma processing Francis F. Chen and Jane P. Chang
title_fullStr Lecture notes on principles of plasma processing Francis F. Chen and Jane P. Chang
title_full_unstemmed Lecture notes on principles of plasma processing Francis F. Chen and Jane P. Chang
title_short Lecture notes on principles of plasma processing
title_sort lecture notes on principles of plasma processing
topic Plasmaphysik (DE-588)4046259-6 gnd
Plasmatechnik (DE-588)4140353-8 gnd
topic_facet Plasmaphysik
Plasmatechnik
url http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=018477504&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
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