Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies
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| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Boston [u.a.]
Newnes
2002
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| Schlagworte: | |
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MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV013305462 | ||
| 003 | DE-604 | ||
| 005 | 20030115 | ||
| 007 | t| | ||
| 008 | 000817s2002 xx ad|| |||| 00||| eng d | ||
| 020 | |a 0750672188 |9 0-7506-7218-8 | ||
| 035 | |a (OCoLC)247360904 | ||
| 035 | |a (DE-599)BVBBV013305462 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 |a DE-83 | ||
| 050 | 0 | |a TK7836 | |
| 082 | 0 | |a 621.381/046 |2 21 | |
| 084 | |a ZM 8455 |0 (DE-625)157204: |2 rvk | ||
| 084 | |a ZN 4125 |0 (DE-625)157354: |2 rvk | ||
| 100 | 1 | |a Lee, Ning-Cheng |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Reflow soldering processes and troubleshooting |b SMT, BGA, CSP and flip chip technologies |c Ning-Cheng Lee |
| 264 | 1 | |a Boston [u.a.] |b Newnes |c 2002 | |
| 300 | |a IX, 270 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Electric connectors | |
| 650 | 4 | |a Electronic apparatus and appliances |x Design and construction | |
| 650 | 4 | |a Electronic packaging | |
| 650 | 4 | |a Solder and soldering | |
| 650 | 0 | 7 | |a Oberflächenmontiertes Bauelement |0 (DE-588)4132685-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Oberflächenmontage |0 (DE-588)4248071-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Reflow-Löten |0 (DE-588)4273607-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Löten |0 (DE-588)4036162-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Reflow-Löten |0 (DE-588)4273607-9 |D s |
| 689 | 0 | 1 | |a Oberflächenmontage |0 (DE-588)4248071-1 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Oberflächenmontiertes Bauelement |0 (DE-588)4132685-4 |D s |
| 689 | 1 | 1 | |a Löten |0 (DE-588)4036162-7 |D s |
| 689 | 1 | |5 DE-604 | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-009071444 | |
Datensatz im Suchindex
| _version_ | 1819245302045999104 |
|---|---|
| any_adam_object | |
| author | Lee, Ning-Cheng |
| author_facet | Lee, Ning-Cheng |
| author_role | aut |
| author_sort | Lee, Ning-Cheng |
| author_variant | n c l ncl |
| building | Verbundindex |
| bvnumber | BV013305462 |
| callnumber-first | T - Technology |
| callnumber-label | TK7836 |
| callnumber-raw | TK7836 |
| callnumber-search | TK7836 |
| callnumber-sort | TK 47836 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZM 8455 ZN 4125 |
| ctrlnum | (OCoLC)247360904 (DE-599)BVBBV013305462 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik Werkstoffwissenschaften / Fertigungstechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01652nam a2200469 c 4500</leader><controlfield tag="001">BV013305462</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20030115 </controlfield><controlfield tag="007">t|</controlfield><controlfield tag="008">000817s2002 xx ad|| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0750672188</subfield><subfield code="9">0-7506-7218-8</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)247360904</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV013305462</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7836</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield><subfield code="2">21</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZM 8455</subfield><subfield code="0">(DE-625)157204:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4125</subfield><subfield code="0">(DE-625)157354:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Lee, Ning-Cheng</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Reflow soldering processes and troubleshooting</subfield><subfield code="b">SMT, BGA, CSP and flip chip technologies</subfield><subfield code="c">Ning-Cheng Lee</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boston [u.a.]</subfield><subfield code="b">Newnes</subfield><subfield code="c">2002</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">IX, 270 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electric connectors</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic apparatus and appliances</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Solder and soldering</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Oberflächenmontiertes Bauelement</subfield><subfield code="0">(DE-588)4132685-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Oberflächenmontage</subfield><subfield code="0">(DE-588)4248071-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Reflow-Löten</subfield><subfield code="0">(DE-588)4273607-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Löten</subfield><subfield code="0">(DE-588)4036162-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Reflow-Löten</subfield><subfield code="0">(DE-588)4273607-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Oberflächenmontage</subfield><subfield code="0">(DE-588)4248071-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Oberflächenmontiertes Bauelement</subfield><subfield code="0">(DE-588)4132685-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Löten</subfield><subfield code="0">(DE-588)4036162-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-009071444</subfield></datafield></record></collection> |
| id | DE-604.BV013305462 |
| illustrated | Illustrated |
| indexdate | 2024-12-23T15:25:19Z |
| institution | BVB |
| isbn | 0750672188 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009071444 |
| oclc_num | 247360904 |
| open_access_boolean | |
| owner | DE-703 DE-83 |
| owner_facet | DE-703 DE-83 |
| physical | IX, 270 S. Ill., graph. Darst. |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | Newnes |
| record_format | marc |
| spelling | Lee, Ning-Cheng Verfasser aut Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee Boston [u.a.] Newnes 2002 IX, 270 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd rswk-swf Oberflächenmontage (DE-588)4248071-1 gnd rswk-swf Reflow-Löten (DE-588)4273607-9 gnd rswk-swf Löten (DE-588)4036162-7 gnd rswk-swf Reflow-Löten (DE-588)4273607-9 s Oberflächenmontage (DE-588)4248071-1 s DE-604 Oberflächenmontiertes Bauelement (DE-588)4132685-4 s Löten (DE-588)4036162-7 s |
| spellingShingle | Lee, Ning-Cheng Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd Oberflächenmontage (DE-588)4248071-1 gnd Reflow-Löten (DE-588)4273607-9 gnd Löten (DE-588)4036162-7 gnd |
| subject_GND | (DE-588)4132685-4 (DE-588)4248071-1 (DE-588)4273607-9 (DE-588)4036162-7 |
| title | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies |
| title_auth | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies |
| title_exact_search | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies |
| title_full | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_fullStr | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_full_unstemmed | Reflow soldering processes and troubleshooting SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_short | Reflow soldering processes and troubleshooting |
| title_sort | reflow soldering processes and troubleshooting smt bga csp and flip chip technologies |
| title_sub | SMT, BGA, CSP and flip chip technologies |
| topic | Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement (DE-588)4132685-4 gnd Oberflächenmontage (DE-588)4248071-1 gnd Reflow-Löten (DE-588)4273607-9 gnd Löten (DE-588)4036162-7 gnd |
| topic_facet | Electric connectors Electronic apparatus and appliances Design and construction Electronic packaging Solder and soldering Oberflächenmontiertes Bauelement Oberflächenmontage Reflow-Löten Löten |
| work_keys_str_mv | AT leeningcheng reflowsolderingprocessesandtroubleshootingsmtbgacspandflipchiptechnologies |