Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications
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| Körperschaft: | |
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| Format: | Tagungsbericht Buch |
| Sprache: | English |
| Veröffentlicht: |
Pennington, NJ
Electrochemical Soc.
1995
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| Schriftenreihe: | Electrochemical Society: Proceedings
1995,7 |
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| 245 | 1 | 0 | |a Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications |c organizers/ed. C. E. Hunt ... |
| 246 | 1 | 3 | |a Semiconductor wafer bonding: physics and applications |
| 246 | 1 | 3 | |a Semiconductor wafer bonding: physics and applications III |
| 264 | 1 | |a Pennington, NJ |b Electrochemical Soc. |c 1995 | |
| 300 | |a VIII, 610 S. |b Ill., graph. Darst. | ||
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| 490 | 1 | |a Electrochemical Society: Proceedings |v 1995,7 | |
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| 650 | 7 | |a Semiconducteurs |2 ram | |
| 650 | 4 | |a Semiconductor wafers |v Congresses | |
| 650 | 4 | |a Semiconductors |x Bonding |v Congresses | |
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Datensatz im Suchindex
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| author_corporate | International Symposium on Semiconductor Wafer Bonding: Physics and Applications Reno, Nev |
| author_corporate_role | aut |
| author_facet | International Symposium on Semiconductor Wafer Bonding: Physics and Applications Reno, Nev |
| author_sort | International Symposium on Semiconductor Wafer Bonding: Physics and Applications Reno, Nev |
| building | Verbundindex |
| bvnumber | BV013175937 |
| callnumber-first | T - Technology |
| callnumber-label | TK7871 |
| callnumber-raw | TK7871.85 |
| callnumber-search | TK7871.85 |
| callnumber-sort | TK 47871.85 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | UP 7570 |
| ctrlnum | (OCoLC)34108551 (DE-599)BVBBV013175937 |
| dewey-full | 621.3815/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815/2 |
| dewey-search | 621.3815/2 |
| dewey-sort | 3621.3815 12 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| genre | (DE-588)1071861417 Konferenzschrift 1995 Reno Nev. gnd-content |
| genre_facet | Konferenzschrift 1995 Reno Nev. |
| id | DE-604.BV013175937 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:40:19Z |
| institution | BVB |
| institution_GND | (DE-588)1801068-4 |
| isbn | 1566771013 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-008977284 |
| oclc_num | 34108551 |
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| owner | DE-703 |
| owner_facet | DE-703 |
| physical | VIII, 610 S. Ill., graph. Darst. |
| publishDate | 1995 |
| publishDateSearch | 1995 |
| publishDateSort | 1995 |
| publisher | Electrochemical Soc. |
| record_format | marc |
| series | Electrochemical Society: Proceedings |
| series2 | Electrochemical Society: Proceedings |
| spelling | International Symposium on Semiconductor Wafer Bonding: Physics and Applications 3 1995 Reno, Nev. Verfasser (DE-588)1801068-4 aut Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications organizers/ed. C. E. Hunt ... Semiconductor wafer bonding: physics and applications Semiconductor wafer bonding: physics and applications III Pennington, NJ Electrochemical Soc. 1995 VIII, 610 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electrochemical Society: Proceedings 1995,7 Plaquettes à gravure en semiconducteurs ram Semiconducteurs ram Semiconductor wafers Congresses Semiconductors Bonding Congresses Wafer (DE-588)4294605-0 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 1995 Reno Nev. gnd-content Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s DE-604 Hunt, C. E. Sonstige oth Electrochemical Society: Proceedings 1995,7 (DE-604)BV001900941 1995,7 |
| spellingShingle | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications Electrochemical Society: Proceedings Plaquettes à gravure en semiconducteurs ram Semiconducteurs ram Semiconductor wafers Congresses Semiconductors Bonding Congresses Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| subject_GND | (DE-588)4294605-0 (DE-588)4232594-8 (DE-588)1071861417 |
| title | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications |
| title_alt | Semiconductor wafer bonding: physics and applications Semiconductor wafer bonding: physics and applications III |
| title_auth | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications |
| title_exact_search | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications |
| title_full | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications organizers/ed. C. E. Hunt ... |
| title_fullStr | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications organizers/ed. C. E. Hunt ... |
| title_full_unstemmed | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications organizers/ed. C. E. Hunt ... |
| title_short | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications |
| title_sort | proceedings of the third international symposium on semiconductor wafer bonding physics and applications |
| topic | Plaquettes à gravure en semiconducteurs ram Semiconducteurs ram Semiconductor wafers Congresses Semiconductors Bonding Congresses Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| topic_facet | Plaquettes à gravure en semiconducteurs Semiconducteurs Semiconductor wafers Congresses Semiconductors Bonding Congresses Wafer Bonden Konferenzschrift 1995 Reno Nev. |
| volume_link | (DE-604)BV001900941 |
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