Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado
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| 005 | 19980623 | ||
| 007 | t| | ||
| 008 | 950802s1995 xx ad|| |||| 10||| und d | ||
| 020 | |a 0930815424 |9 0-930815-42-4 | ||
| 035 | |a (OCoLC)633818359 | ||
| 035 | |a (DE-599)BVBBV010324319 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | |a und | ||
| 049 | |a DE-91 | ||
| 084 | |a ELT 299f |2 stub | ||
| 111 | 2 | |a International Conference and Exhibition on Multichip Modules |n 4 |d 1995 |c Denver, Colo. |j Verfasser |0 (DE-588)5151670-6 |4 aut | |
| 245 | 1 | 0 | |a Proceedings |b April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado |c 1995 International Conference on Multichip Modules |
| 264 | 1 | |a Reston, Va. |b ISHM, The Microelectronics Soc. |c 1995 | |
| 300 | |a 572 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
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| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-006870459 | |
Datensatz im Suchindex
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|---|---|
| adam_text | Table
of Contents
Military and Space
Chairs:
Hans Hentzell, IMC Microsystems
E. Jan Vardaman, Techsearch International, Inc.
001
Flash Memory Modules for Military Avionics
Applications
William R. Newberry, NAnONAL SEMICONDUCTOR
007
Aladdin: Packaging Lessons Learned
Robert E. Terrill, TEXAS INSTRUMENTS
012
Thermal and Structural Analysis of the
Advanced Flight Computer Multi-Chip Module
Thomas
Borden,
Mike Blakely, Leon Alkalaj, JETPROPUL-
SIONLABS
018 486
Computer Module System
Jan Carlson, COMBTTECH ELECTRONICS
AB
024 256
Mbits MCM-V
Memory Stack
Agustín
Coello-Vera,
Marc Masgrangeas, ALCATEL ESPACE;
Christian
Val,
Michel
Leroy,
THOMSOM-CSF
DOI
030
Conversion of Memory Module from MCM-D to
Laminate Base
Albert Pruitt, TEXAS INSTRUMENTS, INC.
MCM-L Technology
Chairs:
Theodore G. Tessier, Motorola, Inc.
Łany
Moresco,
Fujitsu Computer Packaging Tech., Inc.
036
High Reliability, High Density Build Up Printed
Circuit Board for MCM-L
Masanori Nakamura, Motoji
Kato,
IBIDEN
USA CORP.; Motoo
Asai,
Hiroki
Такепака,.ЮЯШ?
CO., LTD.
042
Selecting Flip Chip on Board
Compatible
High
Density PWB Technologies
Theodore G. Tessier, J. Aday, H. Crews, MOTOROLA, INC
052
Conformai
Multichip-on-Flex (MCM-F)
Technology
Raymond A. Fillion, Robert Wojnarowski, Bernard Gorowitz,
Wolfgang
Daum,
Herb Cole, GE-CORPORATE RESEARCH
&
DEVELOPMENT
059
A New Circuit Substrate for MCM-L
Yusuke
Wada,
Kenji Sasaoka, Eiji
Imamura, Hiroshi
Odairą
TOSHIBA
065
A Pathway to Next Generation Multichip
Module Laminate Packaging
Lizabeth A. Schneggenburger, J.E. Economy, UNIVERSITY OF
ILLINOIS AT URBANA-CHAMPAIGN
071
Laser Via Technologies for High Density
MCM-L Fabrication
Joan
Tourne,
MOMMERS PRINT SERVICE
BV
MCM-C
Chairs:
Koichi
Niwa,
Fujitsu
Richard Sigliano,
Kyocera
America, Inc.
077
High Performance Ceramic Modules and
Packages
Paul A.
Danner,
PACIFIC MICROELECTRONICS CORP.
;
Juan
L. Sepulveda, BRUSH WELLMAN
083
Characteristics of Low-Temperature Firing
Ceramics and Its Application to
MCM
Kazunori Miura, Yukihiro Kimura, Kazuo Kondo, Toshiyasu
Asano,
ffisao Banno, NGK SPARK PLUG CO., LTD., R&D
CENTER
089
Electrical Analysis of a Cofired Ceramic
Multichip Module Substrate
William R. Blood, Eugene F. Heimbecher, MOTOROLA, INC.
095
Underwater Digital Signal Processing Unit
Implemening MCM-C Technology
Fred D. Barlow, D. J. Moore, A. Elshabini-Riad, VIRGINIA
TECH
100
Versatile, Low Cost, Multilayer Ceramic Board
on Metal Core
AnandaH. Kumar, Barry J. Thaler, AshokN. Prabhu, DAVID
SARNOFF RESEARCHCENTER
108
Advanced Data Transfer Module Using MCM-C
Technology
Nick Volkringer, Eugene Atwood, John
Drummond,
IBM
MICROELECTRONICS; Raymond
Astrae,
Greg Burmester,
USAF, SM-ALC/TIEFB
Automotive Applications
Chairs:
R. Wayne Johnson, Auburn University
J. Chauvet Parker,
Delco
Electronics
114
Test Development of a Microcontroller-Based
MCM
for Automotive Applications
Victor P. Nelson, AUBURN UNIVERSITY; Andrew Flint,
MOTOROLA, INC.
120
Multichip Modules: Analysis of Electromag¬
netic Interference Effects by
MCM
Implemen¬
tation vs. Single-Chip Package Approach
Larry Bosley, Kevin Slartery, David Canestrari, CHRYSLER
CORP.
;
Jim Trent, MOTOROLA SEMICONDUCTOR
PRODUCTS SECTOR
126
BGA Solder Joint Reliability Study for Auto¬
motive Electronics
Theresa Lindley,
DELCO
ELECTRONICS
134
MCM
Packaging Alternatives for Automotive
Electronics: Comparing Fine Pitch, Ball Grid
Array, and Polyimide Chip Carriers
John L. Evans, Chris S. Romanczuk, Larry E. Bosley,
CHRYSLER CORP.
;
R. Wayne Johnson, A UBURN UNIVER¬
SITY
Diamond Technology
Chairs:
R. Wayne Johnson, Auburn University
J. Chauvet Parker,
Delco
Electronics
140
A Novel Process for Planarizing CVD-Diamond
Substrates for
MCM
Application
Ajay P. Malshe, J. G.
dezen,
H.
A. Naseem,
W.
D.
Brown, L.
W.
Schaper,
ШОН
DENSITY
ELECTRONICS CENTER
(HiDEC)
146
Filled-Via Formation in Diamond Substrates
WilliamE. Wesolowski, R. J. DeKenipp, RAYTHEON CO.;
M.P. Ram Panicker, MICRO SUBSTRATES CORP.
152
High Density Interconnect with Diamond
Substrate
Richard J. Connery, C.L.
Spiro,
CD. Iacovangelo, J.C. Grande,
GE CORPORATE RESEARCH
&
DEVELOPMENT
Modeling
&
Analysis
Chairs:
Luu Nguyen, National Semiconductor Corp.
Phil Dean, MCNC
158
High Frequency Measurements on Modern
MCM
Structures
Hong Huang, Charles E. Free, Keith E.G. Pit, MIDDLESEX
UNIVERSITY; Mm R. Berzins, Gary P. Shorthouse, KonserQ,
Ltd.
164
Microwave Characterization of Low
Temperature Cofired Ceramic Tape
S. Vasudevan, A. Shaikh,
FERRO
CORPOMnON, EUD
175
Electrical Behavior of Multichip Modules in the
Presence of Power and Ground Plane Noise
G. T. Lei, R.W. Techentin and B.K. Gilbert,
MÁYOFOUNDA-
185
Power Distribution System of the Interconnected
Mesh Power System (IMPS)
Yee Low, Leonard W.
Schaper,
Simon
S. Ang,
HIDEC/
UNIVERSITY OF ARKANSAS
191
Programmable MCMs for High Speed
Applications
Herb Stopper, Jeff Banker, Rob Miller, PICO SYSTEMS, INC.
Thin Film Processes
Chairs:
Robert H. Heistand II, Dow Chemical Co.
Thomas F. Redmond, IBM
197
High-Speed and Compact Pin-Grid-Array
Package for MCMs
Šatoru
Yamaguchi, Hisashi Tomimuro, Yukiharu Ohno, NTT
INTERDISCIPLINARY RESEARCH LABS
203
Processing and Electrical Characterization of
Multilayer Metallization for Microwave Applica¬
tions
Percy Chinoy, M/A-COM, INC.
209
Improving Wireability on Non-Planar Structures
for the Next MCM-D Generation
Eric
Perfecto,
Madhavan Swaminathan,
Hai Longworth,
John
Pennachia, George White, Michael McAllister, IBM
216
Evaluation of Multi-Level Thin Film Structures-
A Case Study
Daniel
Berger,
John R.
Pernacchia,
Eric
Perfecto,
Hai
P.
Longworth, Ahmed Omar, Mary Cullinan-Scholl, Raj
Patel,
George White, IBM
223
High Reliability
4
Metal Layer MCM-D
Structure with BCB as Dielectric
Jan Strandberg, Heike Thiede,
Anita
Karlsson,
Anders
Weiland,
IMC
229
Production Update: Report on Volume
MCM
Implementation
Linda Matthew, Nicholas Brathwaite, Kirk Flatow, Harry
Whittemore, Luc Bauer,
пСШР
Low Cost
MCM
Manufacturing
Chairs:
Barbara Vasquez, Motorola, Inc.
David Tuckerman, nChip
ARPA
Support for US
MCM
Manufacturing
NickNaclerio.^RP/i
235
Recent Developments in the Production and
Application of Advanced Laminate Based MCMs
and Chip Carriers
Larry
С
Lemke, SHELDAHL,
INC.
241
Consortium
for
Automotive
Electronics: An
Approach to
MCM
Technology Development
R. Wayne Johnson, AUBURN UNIVERSITY; Mamie Knadler,
A VEX ELECTRONICS; George Petrovic, ALLIED SIGNAL;
Chauvet Parker,
DELCO
ELECTRONICS; Jay Desai,
AMP+AKZO, CAROLINA CIRCUITS; Larry Bosley,
CHRYSLER; Mike Witty,
DELCO
ELECTRONICS; Kevin
Prodromides, ALLIED SIGNAL
249
MCM-D Consortium
Gregory LieVan, TEXAS INSTRUMENTS; Peter Ludlow, MCM-
D CONSORTIUM
253
Consortium for Intelligent Large Area Process¬
ing (CILAP)
Larry
Laureen,
Phil
Garrou, DOW
CHEMICAL
259
The Low-Cost Chip Consortium: An ARPA-
Funded Technology Reinvestment Program
Paul R. Van Loan, HEWLETT PACKARD
262
Multichip Module Outlook: A Perspective on
Low-Cost Solutions
E. Jan Vardaman, TECHSEARCHINTERNATIONAL, INC.
Interconnections
Chairs:
Srinivas Rao,
Soletron
Herbert Reichl,
Technische
Universität
Berlin
268
Development of Low-Cost Three-Dimensional
Packages
Seung-Ho Ahn,
SAMSUNG SEMICONDUCTOR CO.
279
Evamtion of Flip Chip Interconnects Using
Acoustic Microscopy for Failure Analysis and
Process Control Applications
Janet E. Semmens, S. R. Martell, L. W.
Kessler,
SONOSCÁN,
INC.
286
Integrating Wire Bond Die from Multiple
Vendors on a C4~Based
MCM
Tom Bardsley, John
Drummond,
Jed Eastman, IBM CORP.
292
Wire Bonding to Multichip Modules and Other
Soft Substrates
George G.
Hárman,
NAT
L
INST. OFSTAND. &
TECH.
302
Advanced LSI Package Using Stud-Bump-
Bonding Technology <CSP (Chip Size Package)>
Yoshifumi Nakamura,
Tora Ishida,
Yoshihiro Bessho, Yoshihiro
Tomura, Masahide Tsukamoto, MATSUSHITA ELECTRIC
INDUSTRIAL CO., LTD.
308
An Integrated Model for Ball Grid Array Solder
Joint Reliability
Teh-Hua
Ju, Y. C
Lee, S. Hareb, Y. W. Chan, UNIVERSITY OF
COLORADO
Laser and Materials Technology
Chairs:
William R. Bratschun, Motorola, Inc.
Rajen
Chanchani,
Sandia
National Laboratories
314
A Laser Drill and Patterning System for Low
Cost, Rapid Prototyping
Mark F. Eskew, Charlotte Fisher, TEXAS INSTRUMENTS
320
Projection Laser Ablation Mask Alternatives
Rajesh S.
Patel,
W. H.
Advocate,
S. Mukkavilli,
IBM
MICRO¬
ELECTRONICS
327
Large-Area, High-Throughput, High-Resolution
Patterning and Via-Drilling System
K. Jain, Jeffrey Hoffman, Thomas Dunn, William Folster,
Dharmesh Panchal, ANVIKCORPORAnON
336
Silver Metallization for Advanced Interconnects
Frank Stepniak, Paul A. Kohl, Sue Ann Bidstrup, GEORGIA
TECH
341
Mixed Ag/Au Conductors in LTCC
Howard Sawhill, Joseph R. Rellick, Richard R. Draudt,
DUPONT
ELECTRONICS; Leslie A. Momoda, John J. Vajo,
HUGHES RESEARCH LABORATORIES
347
Preparation and Characterization of Dielectric
Thin Films for Decoupling Capacitors
Minehara Tsukada, J. S. Cross, M. Nishizawa, K. Kurihara,
N.
КашеЪага,
FUJITSU
Thin Films:
Structure
&
Applications
Chairs:
Howard M. Clearfield, IBM Microelectronics
Chung W. Ho, Micro Module Systems
352
PCMCIA Hard Disk Card Subsystem Using
MCM-D/L
W. C. Robinette,
MICROMODULE SYSTEMS
358
SD-Multichip Module
O. Ehrman, K. Buschick, G.
Chmiel,
A. Paredes,
V. Glaw, H.
Reichl, TECHNICAL UNIVERSITY OF BERLIN
364
Design and Build of HDI-on-Diamond MCMs
Bob DeKenipp, B. W. Chignola, W. E. Wesolowski,
RAYTHEON CO.;
С
W. Ho, W. E.
Johns, MICROMODULE
SYSTEMS
370
Superconducting Multi-chip Modules for
Microwave and Digital Applications
Andrew D. Smith, G. Akerling, B.J. Dalrymple, R.D.
Sandell,
TRW
375
Two Layer Silicon Hybrids Interconnect Tech¬
nology
Jo Lernout, A. Van Calster, M.
Vereeken,
UNIVERSITY
OF
GHENT; G. Schols, ALCATEL
METEC
381
MIDAS: A Service to Obtain Low-Cost Proto¬
type Quantities of MCMs from Commercial
Foundries
Jennifer Peltier, Wes
Hansford,
USC/LNFOBMATIONSCI¬
ENCES INSTITUTE
Design
&
Test
Chairs:
Carol Marnow, Micro Module Systems
Albert W. Lin, Industrial Technology Research Institute
387
Visual Reality in
MCM
Peter S. Wang, AT&TBELL LABS
395
Common Processor Element
MCM
Packaging
JohnNieznanski, Brian Box, LOCKHEED SANDERS, INC.
401
Tradeoff Analysis and Partitioning in Multiple
Board/MCM Systems
Peter A.
Sandborn,
Ashish R_ Parikh,
SAVÂNTAGE,
INC.
407
Analysis and Comparison of Chip Footprints for
MCM
Technologies
Scott M.
Westbrook,
Carol Marnow, MICROMODULE
SYSTEMS
413
Implementation of a High Speed Processor Node
Michael D. Glover, David L. Andrews, UNIVERSITY OF
ARKANSAS
419
Test Strategy for a Microprocessor Based Multi-
Chip Module
Stuart A. Berke,
David J. Golden, Edwin A. Rogers,
RA
YTHEON COMPANY
424
MCM
Test and Methodologies and Project
Experiences
LynnE. Roszel, TEXAS INSTRUMENTS
Known Good Die
Chairs:
Lina Prokopchak,
Aehr Test Systems
Jody
Van
Hom,
IBM General Technology Division
428
Mechanical, Electrical, and Thermal Evaluation
of Known Good Die Carriers
Cynthia Murphy, Charles Spooner, Larry Gilg,
MCC
434
A Techaology for Known Good Die Test and
Вигв-Ів
Ichiro Fujisniro, YAMAICHI ELECTRONICS
440
Developing a Reusable Known-Good-Die Carrier
Paul Burke, AEHR Test Systems
446
Mechanical and Electrical Evalution of C4 Bare-
Die Carriers for Burn-In and Test of Bumped
Motorola Chips.
Scott Lindsey, Lih-Tyng Hwang, Wilburn Ivy, Tom Myers,
Mike Seeley, John Stafford, Bill Williams, MOTOROLA, INC.
454
Unique Solutions for Bare Die Handling
Jeannne Beacham, GEL-PACMCHEM
460
Process Equipment Integration for Known Good
Die
Rick Heimann,
Randy Roebuck, Texas Instruments, Inc.
;
Robert
Folaron, Jennifer Folaron, Cybex Technologies Corp.
Telecom Applications
Chairs:
Hjalmar Hesselbom,
Ericsson
Akshay V. Shah, AT&T Labs
466
A Chip-on-Chip DSP/SRAM Multichip Module
King L.
Tai,
Robert
С
Frye, Byung J. Han, Maureen Y.
Lau,
Dean Kossives, AT&TBELL LABORATORIES
472
Packaging Technology for High-Speed Multichip
Modules with a Copper-Polyimide Thin-Film
Multilayer Substrate
Satom
Yamaguchi, Hisashi Tomimuro, Yukiharu Ohno, NTT
INTERDISCIPLINARY RESEARCH LABS; Shigeki
Hino,
NTT
NETWORK SERVICE SYSTEMS LABS
478
Case Study of A Low-Cost Plastic/MCM-L
Memory Module
Victor J. Falgiano,
NATIONAL
SEMICONDUCTOR
483
Glass-Ceramic Multichip Module for Satellite
Microwave Communication Systems
Kazuhiro Dcuina,
M.
Kimura,
К.
Utsumi,
S.
Ohmagari,
Y.
Kosugi,
O. Yamamoto,
NEC CORPORATION
489
Design Techniques for Mixed Analog, Digital
and RF MCMs for Wireless Telecommunication
Applications
Ravender Goyal, MENTOR GRAPHICS CORPORAnON
495
Designing for Manufacturability and Improved
Memory Density
Frank Henry, Amanda G.
Noe, DSC
COMMUNICATIONS
CORP.
Dielectrics
&
Processing
Chairs:
Paul Kohl, Georgia Tech
Raju
Pendse, Hewlett-Packard
501
Polyimides for Large Area Multichip Modules
William Lautenberger,
DUPONT;
Brian
С
Auman, Joseph R.
Butera,
David L.
Goff,
Christina
N.
Lazaridis, Henry K.
Seiler,
DUPONT;
Jeff
W. Labadie,
IBM
507
Applications
of PMDA-ODA Polyimide in
MCM-D
Dale McHerron, Walter
С
Seebold,
Kimberly Kelly, John
Pernacchia,
IBM MICROELECTRONICS; William
Weber,
Richard
Hopla,
Tai-Shih
Maw, Drew
Roza, OCG
MICROELEC¬
TRONICS; Roger
Malherbe,
CIBA
513
The Use of BCB and Photo-BCB Dielectric in
MCM-D for High Speed Digital and Microwave
Applications
Eric Beyne, R. Van Hoof, IMEC;
A. Achem, DOW
EUROPE
519
Thin-Film
1С
Packaging for
MCM
Applications
Robert
Caminetti,
Mark J.
Loboda,
DOW CORNING CORPO-
RAÏÏON
524
Chip-on-Board for Large Area Die- An Assess¬
ment of Low Stress
Glob
-Тор
Materials
Rory Doyle, Brendan O Flynn, John Barrett,
Orla Slattery,
Willie Lawton, NAHONAL MICROELECTRONICS RESEARCH
CENTER
531
An Environmentally Conscious Manufacturing
System for Printed Wiring Board Fabrication
Taking Advantage of Thin Copper Substrates
Larry
С
Lemke, SHELDAHL,
INC.
MCM-L Applications
Chairs:
Hassan Hashemi,
MCC
Mat
Nowak,
Unisys Corp.
537
MCM-L Substrates for a
300
MHz Workstation
David Carey,
MCC;
Terri
Houston, Miguel Jimarez, IBM; Joe
Ricks, MOTOROLA; Tom Chung, TANDEM COMPUTERS
543
Higher Density PWB s for Enhanced SMT and
Bare Chip Assembly Applications
Michael
Moser,
HEWLETT-PACKARD
GmbH;
T. G. Tessier,
MOTOROLA
Flexibility and Performance of Texas Instru¬
ments Multi-Layer Thin Film/Laminate Inter¬
connect Technology
David Walter, TEXAS INSTRUMENTS
559
Laminate Based Substrates in Semiconductor
Packages
Michael Freda, AMKOR ELECTRONICS, INC.
;
Jeff Kennedy,
ACS1STASSOCIATES, INC.
567
MCM
Substrates Fabricated Using Flexible
Polyimide Film
Chris Schreiber,
PACKARD-HUGHES INTERCONNECT
|
| any_adam_object | 1 |
| author_corporate | International Conference and Exhibition on Multichip Modules Denver, Colo |
| author_corporate_role | aut |
| author_facet | International Conference and Exhibition on Multichip Modules Denver, Colo |
| author_sort | International Conference and Exhibition on Multichip Modules Denver, Colo |
| building | Verbundindex |
| bvnumber | BV010324319 |
| classification_tum | ELT 299f |
| ctrlnum | (OCoLC)633818359 (DE-599)BVBBV010324319 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
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| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV010324319 |
| illustrated | Illustrated |
| indexdate | 2024-12-23T13:55:37Z |
| institution | BVB |
| institution_GND | (DE-588)5151670-6 |
| isbn | 0930815424 |
| language | Undetermined |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-006870459 |
| oclc_num | 633818359 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | 572 S. Ill., graph. Darst. |
| publishDate | 1995 |
| publishDateSearch | 1995 |
| publishDateSort | 1995 |
| publisher | ISHM, The Microelectronics Soc. |
| record_format | marc |
| spellingShingle | Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado |
| subject_GND | (DE-588)1071861417 |
| title | Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado |
| title_auth | Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado |
| title_exact_search | Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado |
| title_full | Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado 1995 International Conference on Multichip Modules |
| title_fullStr | Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado 1995 International Conference on Multichip Modules |
| title_full_unstemmed | Proceedings April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado 1995 International Conference on Multichip Modules |
| title_short | Proceedings |
| title_sort | proceedings april 19 21 1995 the adam s mark hotel denver colorado |
| title_sub | April 19 - 21, 1995, the Adam's Mark Hotel, Denver, Colorado |
| topic_facet | Konferenzschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=006870459&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT internationalconferenceandexhibitiononmultichipmodulesdenvercolo proceedingsapril19211995theadamsmarkhoteldenvercolorado |