Proceedings
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Tagungsbericht Buch |
| Sprache: | Undetermined |
| Veröffentlicht: |
Reston, VA
Internat. Soc. for Hybrid Microelectronics
1993
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV010292454 | ||
| 003 | DE-604 | ||
| 005 | 19951108 | ||
| 007 | t| | ||
| 008 | 950713s1993 xx ad|| |||| 10||| und d | ||
| 035 | |a (OCoLC)633464683 | ||
| 035 | |a (DE-599)BVBBV010292454 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | |a und | ||
| 049 | |a DE-91 | ||
| 084 | |a ELT 343f |2 stub | ||
| 111 | 2 | |a European Hybrid Microelectronics Conference |n 9 |d 1993 |c Nizza |j Verfasser |0 (DE-588)1402278-3 |4 aut | |
| 245 | 1 | 0 | |a Proceedings |c 9th European Hybrid Microelectronics Conference, Nice, Acropolis, France, June 2 - 3 - 4, 1993 |
| 264 | 1 | |a Reston, VA |b Internat. Soc. for Hybrid Microelectronics |c 1993 | |
| 300 | |a VII, 499 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 856 | 4 | 2 | |m Digitalisierung TU Muenchen |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=006847367&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-006847367 | |
Datensatz im Suchindex
| _version_ | 1819672964608557056 |
|---|---|
| adam_text | Wednesday/ June
2nd
Plenary Opening Session
..............................................................9
Wednesday/ June
2nd
Session
ÌA
Surface Mount Technology
..................13
Session IB Advanced Materials
..........................51
Session
1С
Thick And Thin Film Technology
..........83
Session ID Product Development
.......................135
Thursday, June
3rd
Session 2A
MCM
Packaging
............................183
Session 2B Sensors
..........................................241
Session 2C Advanced Interconnection
................303
Session 2D Optoelectronics and Microwave
.......359
Friday, June 4th
Session
ЗА
Power Hybrids
...............................405
Session 3B Reliability
......................................451
Plenary Closing Session...
..........................................................493
IV
PLENARY OPENING
SESSION
WELCOME
AND ADDRESSES
:
K-Kwrnell Cretan 9th EHMC,
A. Van Calster, Chairman ISHM European
Поїш
Committee.
Senator P.
Lof
fitte,
President of Route
des
Honte
Technologies ,
Région
Provence -
Alpes
-
Côte D Azur, France.
Prominent
Poper:
Smort
Cards:
an
Industry from an Idea .
.........70
M. Lossus,
Prestóent
Gemplus,
France.
Keynote
Poper:
Miemtechnologies:
International Realities and
Outlooks. Research
and Development in France. .....
11
і і
Gognepain, Director of Deportment
SPI,
CNRS,
France.
SESSION 1A
SURFACE MOUNT
TECHNOLOGY
Отпит: С.
Vol,
Thomson CSf
,
France.
Laser Soldering of Toda/s
Bedronk
Components.
..............14
A.HJ.
Меток,
Philos,
The Netherlands.
Optical Laser Probe for Solder
Joinfs Quality Testing through
Thermal Response Analysis
......-26
W. Oaeys, Y. Donw,
S.
Dita«,
A. Hljozi, V.
QuMœtl,
Universi* de Bordeaux
1,
fronce.
і
Z
-Ажѕ
Conductive
Adhesivas
las
Solder
Replacement.
.............
M
I Chung,
T. Deveteaux,
С.
Monti,
M.
Yon,
N.
(tecto,
j
ILTecfmofosyJiK,
U.SA
interaction of Very High
1
Density SMT Connectors with
| AdvancedMultilayer
Substraies.
_________________
.43
і
Y.
Betopotòy.
Beta, Electronics, U.SA
SESSION
Iß
ADVANCED MATERIALS
Chairman: P.
Colta*,
Nokia, Finland.
Polymeric Composites for
Hybrid Microelectronics
..............52
I. Krivka, R. Kúzel, J.
Prokeš,
0.
Stefan.
Charles University,
Czechoslovak«.
С.
Kason,
].
Kuta,
Chalmers
Mrersiry
of
Technology,
Sweden.
Structure
Dependent Properties
of Organic Field-Effect
Transistors.
................................60
F. DeWfre,
F. Garnier,
R. Hop™,
6-
Horowitz,
P.Lmg.A.Yossar.CN.R.S.France.
P. Alnot, S.
Ite,
В.
Servet,
Thomson CSF/
LCR,
Fronce.
Possibilities and Difficulties with
the Use of Conductive
Adhesives as Solder
Replacement.
..............................
<5S
G. Luyckx, A.
Von
Den Bosh, Grace N.V,
Belgiom.
Environmental Performance
of Conductive Adhesives
Joints.
........................................75
1
Gemo,
DIVWey.D.]. Mams,
loughboraurjh. Univeraty of Technology, U.K.
SESSION
1С
THICK AND THIN FILM
TECHNOLOGY
Clramon: R. feel, Charles
University,
(жгккЫею.
Thin
Fi/m
Technologies for High
Density Active Matrix
Addressed Displays.
..................84
1.
De Boets, A.M.
De Ceber, J.
Capo«, A.
Van
Coter, H. De
Smet,
J.
Vanfleteren,
J.
Farei,
M.
Westeott,
ІШда
Systems Conodo
W,
Congela.
low
Profife,
High Frequency,
Power Supplies Using Thick
Film
Manar
Transformers.
..__....91
P.
Єосгжєй,
I lockson,
Uimerstiy
of
nymauih,
U.S.
Advanced Thick Fib Materials
for Multi-Chip Modules
:
Processing and
Performance.
.............................99
A. Berzins, J. Smythe, G. Shorthouse, Johnson
tócÄev
Technology, U.K.
THICK AND THIN
TECHNOLOGY (continued)
Advanced Processing and
Novel Applications of Hybrid
Multilayer Green Tapes.
...........707
J. Bonsky,
).
Engemonn, university ot
Wuppertal,
Germany.
E.K. Polzer, DuPont Electronics
Gmbh,
Germany.
D. Borttey,
E
.Cose, Michigan
Stote
Uimersiry,
U.SA
A Sealing Process
for Printed-Through
Hofes........715
K. Dröeke,
Philips
Kommui*atms
Industrie
AG,
Gemmy.
An Introduction to Thick Film
Fine-line Printing Screens.
........723
B.P. Carr, Coors Euroscreen/Coors Ceramics
Electronics Ltd, (U.
SESSION ID
135
PRODUCT DEVELOPMENT
Umrem:
В.
George,
Technoompri
Mkradrmts
ltd, U.K.
Solutions for the Printing
and Handing of Co-Fired
Ceramic Materials in Volume
Manufacturing.
........................136
R.ukpatrick.Oek.Ult.
Cost Effective Direct Packaging
of Chip and Wire Hybrids.
.......744
L faaeitnoyr,
1.
Мав,
M.
Soita,
Lewicki Mkroetectrorac
Gmbh,
Germany.
ITCC- An Economical and
Industrial Interconnect and
Packaging Solution
for MCM s.
_____.....................750
i.W. Qcognce,
Ou
Pont us
Невшѕ,
Swfzedoni
E. Polzer,
Du Pont de
Nemours, Germony.
M. ttossiot, E. Percbois, Sorep, France.
PRODUCT
DEVELOPMENT
[continued)
Study of the Thermomechanical
Problems in Hybrid Assemblies
satisfying the Automotive
Electronics Conditions.
..............158
11
Aucouturi«, E. Woitgord,
C Zardmi,
tornerai*
ie
Bouleaux
1,
France.
Silicon Sensors for Automotive
Applications.
...........................166
J.P.
Rouet, G.
Grandjean, Sogem, France.
Future Low Cost Electronics
Packaging for Automotive
Application
..............................174
G. Bonhomme,
R.
H Amans, P. Lewandowski,
Siemens Automotive
SA.Fronce.
SESSION 2A!
MCM
PACKAGING.
Chairman:
t.
Schippet,
Hybnà Mkroeiectronies
Design Support, the
Nethedonds.
Fabrication and Thermal
Analysis of
3
tXmenskmatty
located
Ш
Packages.
..............184
T. íshtóa,
I. Miyano,
S.
Sakoguchi,
К. Ышт,
Hitachi ltd, Japan.
M.
УоггигЈо,
Semiconductor Design
I ond
Bevsiopment
Center, Hitachi ltd.
Jopan.
і
I. Kudoishi, Hitachi
VISI
Engineering Corp,
Jopan.
MCM-L· Muhkhip on
POs,
:
a Complementary Interconnect
toMCM<andMCM-D
| far Avionics Applications..
........192
|
G.
Menozzi, Sextant
Аиолкціе,
France.
і
Advanced Multichip Module
j
Technologies.
...........................200
j
A. Boumgarfner, W.
Heck, Ü.
Meier,
H. Mier, J.
]
Springer,
Alcatel Sel,
Germany.
MCM
PACKAGING
(continued}
Advanced Electronic Packaging
in High Energy Physics.
------.....208
A. Bjomekletr, H.
Månsen,
H. íafjord,
Center for Industrial Research, Norwoy.
High-density Package,
Cofíred,
Multichip Module,
3D,
a Mass
Memory Mixed Technology for
Space Applications.
.................216
».Mossemi,
Mutra
Marconi Space France, France.
Qualification and Validation of
a Process for Thin Film
Muhkhip Module.
....................224
M.
Akmo,
G.
Argooò,
D. Aáert,
M. Beudon,
MJ.
Boużd,
С.
Unisse,
В.
Jourdain,
В.
Imole, J.C.
ОЬегііп,
J.
Pota,
F.
Tempte,
J.
Torres, CNET,
France.
Global
Optimization
ofMCMs
wilh
ASICs Using Concurrent
Engineering.............................232
i.ř.
Cozam«,
G. toperfap, Dossourt
EtectTonkjue, France.
SESSION
2В
SENSORS
ChrJrman:
R.
M Acqua, Miteco,
Haly.
law-Cost Integrated Silicon
Sensors
for Industrial Applications.
.......242
S. Ansermet,
1.
Molan,
D.
Otter,
F.
Roboli,
Ascom Mtooetaronks,
Switzerland.
App&oatkm of a New
PÏÏ
Temperature Sensor with a
Switch-Over
KR
in Food
Industry.
...................._______250
J.J.
Sonde*.
T.W. HoWank,
Krata*
Ш,
Potad.
Instated Metal Substrates
for Thkk Fan Sensor
Applications.
__._____.___......261
D.
Мой,
P.
Roto, A. Totani,
Universita
è
Brescia, Italy.
:
SENSORS ¡continued)
;
-A Thkk Film Resistor Circuit
as a Prosthesis for Blind
Persons.
.......................__..___269
l
De Bœrfer, M.
to,
G. De
Mey, University
oí
.
Ghent, Belgium.
Hybrid Chemical and Physical
Sensor Arrays.
.........................277
Jl Atkinson, University of
Southampton,
U.K.
Thick Film SO2 Sensor.
............289
I. Borycka,
U. Golonka,
G.
Pástiak,
The Technical University of Wrodntv, Poland.
A New Heat Detector for High
Volume Building
Automation
.............................296
M.
Grönlund,
К.
Laiholuoto,
H.
Pohpnen,
Technical Research Centre of Finland, Finland.
SESSION 2C
ADVANCED
INTERCONNECTION
Chairman: P.
Wilhelm,
Philips
Kommunikations
Ind
AG,
Germany.
A Work/wide View of
3D
Interconnection
:
Bare Chip
Stacking/Package
Stacking.
.................................304
C. Vol, Thoroon-CSF,
France.
Surface Activated Bonding
ond
te
Application to
Microbonding
at Room
Temperature
............................314
T.
Sugo,
T.
Fujiwnka,
G. Sosaki,
The University of
Tokyo, Japon.
Manufacturing Yield
Forecasting in High Density
VWre Bonding.
.........................322
I MessrJ, X.
ЅапШоЛ,
M
Я
France.
ADVANCED
INTERCONNECTION
(continued)
Recent Developments
m
High Lead Count TAB
Packaging.
..............................33
J
RJ.
Crowtey,
EJ. Vardoman,
Fľip
-СЫр
Bonding on Green
Tape Ceramic Substrates.
.........339
II Disfa,
Siegelt
Gmbh,
Garnony.
ІВоеиДШ, Е.Ш,
TU
Berin, Micropefipherics
Center,
Germany.
Vi
!
Wins Bumping Technology
for Gokl and Solder Wire
Bumping on
I.C.Devices............357
j
R.T. lee, W.H. lyrle,
Т.Д. Schon,
U. Shnrmo,
Ï
Motoroło
SPS, U.S.A.
SESSION
ЗА
405
SESSION 2D
359
OPTOELECTRONICS AND
MICROWAVE
Chairman
:
M. Ciez, Research
ond
Development
Centre for Hybtid Microelectronics, Pokmd.
M.CM Technology Makes
(he Miniatvrized Optical
Er
Doped Fiber Amplifier
a Reality.
.................................360
G. Delrosso, G.
Grasso,
G.
Szota Miszenh ,
Pirelli
Cmi
SPA,
lidy.
Novel Techniques for tow Cost,
High Performance,
Optoelectronic Component
Assembly.
................................368
I.P.
Holi, BT
Laboratories, U.K.
Technology of Optical
Thkk Films
...............................376
Is Keresztes-Nogy, G. Horsanyi.
| Technical
University
of Budapest, Hungary.
;
OPTOELECTRONICS AND
I MICROWAVE (continued)
Superminhhirized Double-
Balanced Mixer-Modulator for
SMTby Thick Film Print/Fire
Process
....................................384
|
У.
Ando,
У.
Arai,
M. flsawa, Taiset
Co, ltd.
Jopan.
¡MA
Stein,
T.
Woda,
I
Eteclro-Sœnce Loborotories,
Inc,
U.SA
I High-Freąuency
Elements
•
and Components in Thkk-Film
I Multilayer-Circuits.
...................392
j
ti. Iter,
Technical University
Ilmenau, Genroiy.
Gate and Mixed Hybrids
Technologies in the Development
j of Phase Shifter Arrays.
...........400
IE.
Caiena,
I Grate,
A. Di
Man*, U.
Di
j
Marcantonio,
Atenta
Spazio,
Italy.
POWER
HYBRIDS
Chairmen:
G. De
Mey, (Stall University, Belgium.
Application of
Diamond
in Power Device
Modules
.........406
B.FirçliOiWer.W.ffie.R.Kiihnerr,
H. Schworzbaier, Siemens
AG, Geimony.
F. Koch,
ТесЬпЫ
University
of
Мили,
Gemmy.
R.
Messer,
University of
Solfori,
U.K.
A High Performance Hermetic
Direct Bond Copper
Package.
.................................414
M. Anderson, Brush Wdlman
Соф,
U.S.A.
J.
Dickson,
8.
Pakrteer, J.
Grobów,
Tegmen top,
U.SA
Finite Element Analysis
in the Design of a Power
Converter.
...............................421
L
AKwez-Borao,
Cûuinones
ile
lo Guio,
S.
Ollera Vetasco, AkatcJ-Sesa,
Spoin.
Foil
-
Clips
for
Power Module
Interconnects
............................431
H.
Esrom,
HJ. Krokoszinski,
Aseo
Brown
Boveñ,
Germany.
Advanced
Packaging Methods
of Spacecraft Power
Converters.
..............................439
H.K. Kim, Space Systems/loral, U.SA
SESSION 3B
RELIABILITY
Chairman: G. Horsonyi,
Technical University of Budapest, Hungary.
Thin Film HDI for
MCM
Assessment of Behaviour Under
Environment Tests.
Qualitative
Structure Analysis
....................452
J.P. Otoguet, G. Teissiei, Thomson
Hybrides,
Fronce.
A. Belane, S. tose,
Thomson
CSf
(ЅШ,
France.
Topo-Spke Programme
for Electro
-
Thermal
Analysis.
.................................460
A. Kos,
University of Mining and Metallurgy, PaiandjA
Study of Crossover Failures
A Study of Crossover Failures
in Thick Film Multilayers
...........468
W.
De
Сеитск,
J.
toco, I.M.
Stols,
1.
Be
Schepper, Limburg
University
Centre,
Belgium.
M.F. Boeket, WA
Crag,
CR.
Pkksring,
Ot) Pont
ltd,
U.K.
Quality Assurance for Mvm chip
Modules for AMI
Techniques
...............................474
AJ.
Bastet»,
I.W. Kessler, S.R. Matteil,
J.E. Semmens,
Sonoscan Ine,
U.S.A.
Design
Approach to Reliable
Microelectronic Packages
.........484
M.
Cushing,
Ï.
Hokim,
M. Peét, Cake
Electronic
Pockoging Research
Centet,
University of Moiytond,
U.S.A.
PLENARY CLOSING
SESSION
:
Chairman: Y.
Le Goff,
Vice^airman, 9th EHMC
493
Visions of Future in Mkroetectromcs
:
Advanced Products
in
Microfabrications
...............494
Praf.
W.
ВШ,
Ins
m fer
Мгеївскй,
Mainz,
Gemmy.
How Can Europe Succeed
in Microekcironks?
...............495
R.
Heikes,
International Consultant, Fronce.
3D
slide show.
$
mskk of
a H Mbitáips .
IBM.
Essaimes
pbrr.
Fronce.
Congress Report.
J.
Joly,
J. Gurnet, Technical Programme Committee.
Best Paper Award.
С
Vol., Conference Programme.
Student Award.
H.Baudry, Universities liaison.
Announcement of
Ш
EMC
1995.
S. Notfyng,
Miran
10*
EHMC 1
995,
ISHM
Nordic.
Closing Remarks.
K.
Kurarf, Chcromn,
9th EHMC.
VII
|
| any_adam_object | 1 |
| author_corporate | European Hybrid Microelectronics Conference Nizza |
| author_corporate_role | aut |
| author_facet | European Hybrid Microelectronics Conference Nizza |
| author_sort | European Hybrid Microelectronics Conference Nizza |
| building | Verbundindex |
| bvnumber | BV010292454 |
| classification_tum | ELT 343f |
| ctrlnum | (OCoLC)633464683 (DE-599)BVBBV010292454 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Conference Proceeding Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01172nam a2200277 c 4500</leader><controlfield tag="001">BV010292454</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">19951108 </controlfield><controlfield tag="007">t|</controlfield><controlfield tag="008">950713s1993 xx ad|| |||| 10||| und d</controlfield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)633464683</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV010292454</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">und</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 343f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">European Hybrid Microelectronics Conference</subfield><subfield code="n">9</subfield><subfield code="d">1993</subfield><subfield code="c">Nizza</subfield><subfield code="j">Verfasser</subfield><subfield code="0">(DE-588)1402278-3</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Proceedings</subfield><subfield code="c">9th European Hybrid Microelectronics Conference, Nice, Acropolis, France, June 2 - 3 - 4, 1993</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Reston, VA</subfield><subfield code="b">Internat. Soc. for Hybrid Microelectronics</subfield><subfield code="c">1993</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">VII, 499 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Digitalisierung TU Muenchen</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=006847367&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-006847367</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV010292454 |
| illustrated | Illustrated |
| indexdate | 2024-12-23T13:54:51Z |
| institution | BVB |
| institution_GND | (DE-588)1402278-3 |
| language | Undetermined |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-006847367 |
| oclc_num | 633464683 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | VII, 499 S. Ill., graph. Darst. |
| publishDate | 1993 |
| publishDateSearch | 1993 |
| publishDateSort | 1993 |
| publisher | Internat. Soc. for Hybrid Microelectronics |
| record_format | marc |
| spellingShingle | Proceedings |
| subject_GND | (DE-588)1071861417 |
| title | Proceedings |
| title_auth | Proceedings |
| title_exact_search | Proceedings |
| title_full | Proceedings 9th European Hybrid Microelectronics Conference, Nice, Acropolis, France, June 2 - 3 - 4, 1993 |
| title_fullStr | Proceedings 9th European Hybrid Microelectronics Conference, Nice, Acropolis, France, June 2 - 3 - 4, 1993 |
| title_full_unstemmed | Proceedings 9th European Hybrid Microelectronics Conference, Nice, Acropolis, France, June 2 - 3 - 4, 1993 |
| title_short | Proceedings |
| title_sort | proceedings |
| topic_facet | Konferenzschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=006847367&sequence=000002&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT europeanhybridmicroelectronicsconferencenizza proceedings |