Principles of electronic packaging
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
McGraw-Hill
1989
|
| Schriftenreihe: | McGraw-Hill series in electrical engineering : McGraw-Hill series in material science and engineering
|
| Schlagworte: | |
| Tags: |
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MARC
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| 245 | 1 | 0 | |a Principles of electronic packaging |c ed. by Donald P. Seraphim ... |
| 264 | 1 | |a New York [u.a.] |b McGraw-Hill |c 1989 | |
| 300 | |a XXVIII, 962 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a McGraw-Hill series in electrical engineering : McGraw-Hill series in material science and engineering | |
| 500 | |a Literaturangaben | ||
| 650 | 4 | |a Electronic packaging | |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronische Baugruppe |0 (DE-588)4014350-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Montage |0 (DE-588)4040126-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Chip |0 (DE-588)4197163-2 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
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| 689 | 4 | |5 DE-604 | |
| 700 | 1 | |a Seraphim, Donald P. |e Sonstige |4 oth | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-002547602 | |
Datensatz im Suchindex
| DE-BY-TUM_call_number | 0001 90 A 2804 |
|---|---|
| DE-BY-TUM_katkey | 503387 |
| DE-BY-TUM_location | Mag |
| DE-BY-TUM_media_number | 040000725480 |
| _version_ | 1820882533242372096 |
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV004074838 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870 |
| callnumber-search | TK7870 |
| callnumber-sort | TK 47870 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4300 |
| classification_tum | ELT 296f |
| ctrlnum | (OCoLC)18136666 (DE-599)BVBBV004074838 |
| dewey-full | 621.381/73 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/73 |
| dewey-search | 621.381/73 |
| dewey-sort | 3621.381 273 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV004074838 |
| illustrated | Illustrated |
| indexdate | 2024-12-23T11:08:22Z |
| institution | BVB |
| isbn | 0070563063 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-002547602 |
| oclc_num | 18136666 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-29T DE-Aug4 DE-634 DE-83 |
| owner_facet | DE-91 DE-BY-TUM DE-29T DE-Aug4 DE-634 DE-83 |
| physical | XXVIII, 962 S. Ill., graph. Darst. |
| publishDate | 1989 |
| publishDateSearch | 1989 |
| publishDateSort | 1989 |
| publisher | McGraw-Hill |
| record_format | marc |
| series2 | McGraw-Hill series in electrical engineering : McGraw-Hill series in material science and engineering |
| spellingShingle | Principles of electronic packaging Electronic packaging Mikroelektronik (DE-588)4039207-7 gnd Elektronische Baugruppe (DE-588)4014350-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Montage (DE-588)4040126-1 gnd Chip (DE-588)4197163-2 gnd Gehäuse (DE-588)4156307-4 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4014350-8 (DE-588)4014360-0 (DE-588)4040126-1 (DE-588)4197163-2 (DE-588)4156307-4 |
| title | Principles of electronic packaging |
| title_auth | Principles of electronic packaging |
| title_exact_search | Principles of electronic packaging |
| title_full | Principles of electronic packaging ed. by Donald P. Seraphim ... |
| title_fullStr | Principles of electronic packaging ed. by Donald P. Seraphim ... |
| title_full_unstemmed | Principles of electronic packaging ed. by Donald P. Seraphim ... |
| title_short | Principles of electronic packaging |
| title_sort | principles of electronic packaging |
| topic | Electronic packaging Mikroelektronik (DE-588)4039207-7 gnd Elektronische Baugruppe (DE-588)4014350-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Montage (DE-588)4040126-1 gnd Chip (DE-588)4197163-2 gnd Gehäuse (DE-588)4156307-4 gnd |
| topic_facet | Electronic packaging Mikroelektronik Elektronische Baugruppe Elektronisches Bauelement Montage Chip Gehäuse |
| work_keys_str_mv | AT seraphimdonaldp principlesofelectronicpackaging |