High-Temperature Grain-Boundary Embrittlement and Creep

The subject of material failure is vast and expanding rapidly as newer tools for micromechanical examinations and newer materials are being developed and their uses are increasing in wide‐ranging applications, such as nanoengineering. High‐temperature embrittlement has equivocally been linked to the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Sinha, Shoma, Sinha, Nirmal K
Format: Buchkapitel
Sprache:eng
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