Temporary Carrier Technologies for eWLB and RDL‐First Fan‐Out Wafer‐Level Packages

Fan‐out wafer‐level packaging (FO‐WLP) process flows typically fall under two basic integration categories called chip‐first and chip‐last. In both process flows, temporary wafer carrier technologies play a crucial role. Temporary wafer bonding is classified by the mechanisms that break the temporar...

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Bibliographische Detailangaben

Hauptverfasser:	Uhrmann, Thomas, Považay, Boris
Format:	Buchkapitel
Sprache:	eng
Schlagworte:	first fan‐out wafer‐level packages laser‐initiated debonding slide‐off lift‐off debonding temporary carrier technologies temporary wafer bonding UV diode‐pumped solid‐state lasers
Online-Zugang:	Volltext
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