Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan‐Out Wafer‐Level Packaging (FO‐WLP)

This chapter provides an overview of advanced dielectric materials developed by HD Micro Systems (HDM) that are based on polyimide (PI) and polybenzo‐xazole (PBO) technologies and that are targeted for use as redistribution layers (RDL) in fan‐out wafer‐level package (FO‐WLP) applications where lith...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Enomoto, T, Matthews, J.I, Motobe, T
Format:	Buchkapitel
Sprache:	eng
Schlagworte:	dielectric materials FCCSP FO‐WLP applications HDM material PBO‐Gen3 lithography semiconductor applications
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!