Nanometric cutting mechanism of silicon carbide
Ductile to brittle transition is critical to achieve nanometric surfaces in the ultraprecision diamond cutting of silicon carbide. Although atomic simulations have long been used to better understand this mechanism, the extremely small model scale limits its capability in matching the actual cutting...
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| Veröffentlicht in: | CIRP annals 2021, Vol.70 (1), p.29-32 |
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| container_title | CIRP annals |
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| creator | Wang, Jinshi Fang, Fengzhou |
| description | Ductile to brittle transition is critical to achieve nanometric surfaces in the ultraprecision diamond cutting of silicon carbide. Although atomic simulations have long been used to better understand this mechanism, the extremely small model scale limits its capability in matching the actual cutting process. To overcome this serious issue, an enhanced molecular dynamics method is proposed in this study, which successfully predicts and clarifies the onset of brittle regime machining, and indicates the essential roles of dislocation and the shear band. The experimental results validate the effectiveness of this modelling approach. |
| doi_str_mv | 10.1016/j.cirp.2021.04.068 |
| format | Article |
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Although atomic simulations have long been used to better understand this mechanism, the extremely small model scale limits its capability in matching the actual cutting process. To overcome this serious issue, an enhanced molecular dynamics method is proposed in this study, which successfully predicts and clarifies the onset of brittle regime machining, and indicates the essential roles of dislocation and the shear band. 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| ispartof | CIRP annals, 2021, Vol.70 (1), p.29-32 |
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| language | eng |
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| subjects | Cutting Engineering Engineering, Industrial Engineering, Manufacturing Mechanism Science & Technology Silicon carbide Technology |
| title | Nanometric cutting mechanism of silicon carbide |
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