High Entropy Alloys as Filler Metals for Joining

In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with comple...

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Veröffentlicht in:Entropy (Basel, Switzerland) Switzerland), 2021-01, Vol.23 (1), p.78, Article 78
Hauptverfasser: Luo, Dan, Xiao, Yong, Hardwick, Liam, Snell, Robert, Way, Matthew, Sanuy Morell, Xavier, Livera, Frances, Ludford, Nicholas, Panwisawas, Chinnapat, Dong, Hongbiao, Goodall, Russell
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container_issue 1
container_start_page 78
container_title Entropy (Basel, Switzerland)
container_volume 23
creator Luo, Dan
Xiao, Yong
Hardwick, Liam
Snell, Robert
Way, Matthew
Sanuy Morell, Xavier
Livera, Frances
Ludford, Nicholas
Panwisawas, Chinnapat
Dong, Hongbiao
Goodall, Russell
description In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (450 degrees C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.
doi_str_mv 10.3390/e23010078
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subjects alloy design
Alloy development
Alloys
Avionics
brazing
Brazing alloys
Filler metals
High entropy alloys
Intermetallic compounds
joining
Liquidus
Metals
Physical Sciences
Physics
Physics, Multidisciplinary
Review
Science & Technology
soldering
Solid solutions
Temperature
title High Entropy Alloys as Filler Metals for Joining
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