High Entropy Alloys as Filler Metals for Joining
In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with comple...
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Veröffentlicht in: | Entropy (Basel, Switzerland) Switzerland), 2021-01, Vol.23 (1), p.78, Article 78 |
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description | In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (450 degrees C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods. |
doi_str_mv | 10.3390/e23010078 |
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One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 degrees C) and brazing (>450 degrees C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.</description><identifier>ISSN: 1099-4300</identifier><identifier>EISSN: 1099-4300</identifier><identifier>DOI: 10.3390/e23010078</identifier><identifier>PMID: 33430183</identifier><language>eng</language><publisher>BASEL: Mdpi</publisher><subject>alloy design ; Alloy development ; Alloys ; Avionics ; brazing ; Brazing alloys ; Filler metals ; High entropy alloys ; Intermetallic compounds ; joining ; Liquidus ; Metals ; Physical Sciences ; Physics ; Physics, Multidisciplinary ; Review ; Science & Technology ; soldering ; Solid solutions ; Temperature</subject><ispartof>Entropy (Basel, Switzerland), 2021-01, Vol.23 (1), p.78, Article 78</ispartof><rights>2021. 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One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 degrees C) and brazing (>450 degrees C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. 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subjects | alloy design Alloy development Alloys Avionics brazing Brazing alloys Filler metals High entropy alloys Intermetallic compounds joining Liquidus Metals Physical Sciences Physics Physics, Multidisciplinary Review Science & Technology soldering Solid solutions Temperature |
title | High Entropy Alloys as Filler Metals for Joining |
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