Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

Grinding chip thickness is an important parameter to reflect the grinding efficiency and investigate the grinding mechanism. Modeling of the chip thickness is generally based on a certain stochastic distribution model, like Uniform, Gaussian or Rayleigh distribution. This paper is devoted to establish the real grinding chip thickness distribution model for brittle materials based on the material removal mode: coexistence of ductile and brittle removal mode. A grid calculation method will provide a quantitative data of ductile removal surface to validate the chip thickness model. The results show that the grinding chip thickness for Silicon Carbide ceramics is more close to the Rayleigh model with an average error of 3.25% compared with 11.74% of Gaussian model. Finally, grinding experiments were conducted to reveal the Rayleigh model-based grinding temperature characteristics, surface roughness and topography. It was found that ductile-oriented ground surface with a lower surface roughness value was increased with the enhancement of the ductile surface percentage and a substantial suppression of surface crack and damage generation.