Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy
The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis. Anodizing was conducted for 20 min at 200 and 400 A/m^2 in a solution c...
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Veröffentlicht in: | Transactions of Nonferrous Metals Society of China 2009-08, Vol.19 (4), p.904-908 |
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description | The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis. Anodizing was conducted for 20 min at 200 and 400 A/m^2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3·16H2O at 20 ℃. Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films. The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without, indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy. Second phase precipitates such as Si, Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application ofECAP. Al-Cu-Mg intermetallic compounds are dissolved during anodization, whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al. FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds, since the anodic oxide fihns are absent at the boundary between the normal oxide films and these impurity precipitates. The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates, which act as origins of pitting corrosion. |
doi_str_mv | 10.1016/S1003-6326(08)60374-X |
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Anodizing was conducted for 20 min at 200 and 400 A/m^2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3·16H2O at 20 ℃. Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films. The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without, indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy. Second phase precipitates such as Si, Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application ofECAP. Al-Cu-Mg intermetallic compounds are dissolved during anodization, whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al. FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds, since the anodic oxide fihns are absent at the boundary between the normal oxide films and these impurity precipitates. The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates, which act as origins of pitting corrosion.</description><identifier>ISSN: 1003-6326</identifier><identifier>DOI: 10.1016/S1003-6326(08)60374-X</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>aluminum-copper alloy ; anodizing ; equal-channel angular pressing ; pitting corrosion ; 抗点蚀 ; 铝铜合金</subject><ispartof>Transactions of Nonferrous Metals Society of China, 2009-08, Vol.19 (4), p.904-908</ispartof><rights>2009 The Nonferrous Metals Society of China</rights><rights>Copyright © Wanfang Data Co. Ltd. All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c469t-584f6fff1dbd398a962dea3f2de9139e6280f019f9d5ec2a9196badbdb49d51f3</citedby><cites>FETCH-LOGICAL-c469t-584f6fff1dbd398a962dea3f2de9139e6280f019f9d5ec2a9196badbdb49d51f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://image.cqvip.com/vip1000/qk/85276X/85276X.jpg</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S100363260860374X$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27903,27904,65309</link.rule.ids></links><search><creatorcontrib>SON, In-Joon</creatorcontrib><creatorcontrib>NAKANO, Hiroaki</creatorcontrib><creatorcontrib>OUE, Satoshi</creatorcontrib><creatorcontrib>KOBAYASHI, Shigeo</creatorcontrib><creatorcontrib>FUKUSHIMA, Hisaaki</creatorcontrib><creatorcontrib>HORITA, Zenji</creatorcontrib><title>Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy</title><title>Transactions of Nonferrous Metals Society of China</title><addtitle>Transactions of Nonferrous Metals Society of China</addtitle><description>The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis. Anodizing was conducted for 20 min at 200 and 400 A/m^2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3·16H2O at 20 ℃. Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films. The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without, indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy. Second phase precipitates such as Si, Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application ofECAP. Al-Cu-Mg intermetallic compounds are dissolved during anodization, whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al. FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds, since the anodic oxide fihns are absent at the boundary between the normal oxide films and these impurity precipitates. The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates, which act as origins of pitting corrosion.</description><subject>aluminum-copper alloy</subject><subject>anodizing</subject><subject>equal-channel angular pressing</subject><subject>pitting corrosion</subject><subject>抗点蚀</subject><subject>铝铜合金</subject><issn>1003-6326</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNqFkUtP3DAUhbMAiSnlJyBFLCqqKsWOHU-8QhWiDwmJBSDN7spxrgcPHjtjJ6XDr6-HQWzZ-HF97rk6n4vilJLvlFBxcUcJYZVgtTgn7VdB2JxXi4Ni9l4-Kj6ltCKEcyHorFhdG4N6LIMpcTMpV-lH5T26Uvnl5FQsh4gpWb8sgy8HO467ow4xhmRzJT_aNCqvceegfOjtC_alctPa-mld6TAMGPPdhe3n4tAol_DkbT8uHn5e31_9rm5uf_25-nFTaS7kWDUtN8IYQ_uuZ7JVUtQ9KmbyKimTKOqWGEKlkX2DulaSStGpLO54rlDDjotve99n5U2OAaswRZ8nwstym1bpXwdYEyIJJ3WT1V_26iGGzYRphLVNGp1THsOUgPE5b1nLsrDZC3XOniIaGKJdq7gFSmDHHl7Zww4ykBZe2cMi913u-zBn_msxQtIWM7Hexkwe-mA_dDh7m_wY_HKTfwA6pZ-MdQiM1rRhc8r-A1iPnEo</recordid><startdate>20090801</startdate><enddate>20090801</enddate><creator>SON, In-Joon</creator><creator>NAKANO, Hiroaki</creator><creator>OUE, Satoshi</creator><creator>KOBAYASHI, Shigeo</creator><creator>FUKUSHIMA, Hisaaki</creator><creator>HORITA, Zenji</creator><general>Elsevier Ltd</general><general>Department of Materials Process Engineering, Graduate School of Engineering,Kyushu University, 744 Motooka, Nishi-ku, Fukuoka, 819-0395, Japan%Department of Materials Science and Engineering, Faculty of Engineering, Kyushu University,744 Motooka, Nishi-ku, Fukuoka, 819-0395, Japan%Department of Applied Chemistry and Biochemistry, Faculty of Engineering, Kyushu Sangyo University,2-3-1 Matsukadai, Higashi-ku, Fukuoka, 813-8503, Japan</general><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SE</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>2B.</scope><scope>4A8</scope><scope>92I</scope><scope>93N</scope><scope>PSX</scope><scope>TCJ</scope></search><sort><creationdate>20090801</creationdate><title>Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy</title><author>SON, In-Joon ; 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Anodizing was conducted for 20 min at 200 and 400 A/m^2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3·16H2O at 20 ℃. Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films. The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without, indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy. Second phase precipitates such as Si, Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application ofECAP. Al-Cu-Mg intermetallic compounds are dissolved during anodization, whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al. FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds, since the anodic oxide fihns are absent at the boundary between the normal oxide films and these impurity precipitates. The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates, which act as origins of pitting corrosion.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/S1003-6326(08)60374-X</doi><tpages>5</tpages></addata></record> |
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subjects | aluminum-copper alloy anodizing equal-channel angular pressing pitting corrosion 抗点蚀 铝铜合金 |
title | Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy |
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