Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate
The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs direct...
Gespeichert in:
| Veröffentlicht in: | Transactions of Nonferrous Metals Society of China 2008-02, Vol.18 (1), p.132-137 |
|---|---|
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 137 |
|---|---|
| container_issue | 1 |
| container_start_page | 132 |
| container_title | Transactions of Nonferrous Metals Society of China |
| container_volume | 18 |
| creator | 田艳红 王春青 Y. Norman ZHOU |
| description | The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding. |
| doi_str_mv | 10.1016/S1003-6326(08)60024-2 |
| format | Article |
| fullrecord | <record><control><sourceid>wanfang_jour_proqu</sourceid><recordid>TN_cdi_wanfang_journals_zgysjsxb_e200801024</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><cqvip_id>26659054</cqvip_id><wanfj_id>zgysjsxb_e200801024</wanfj_id><els_id>S1003632608600242</els_id><sourcerecordid>zgysjsxb_e200801024</sourcerecordid><originalsourceid>FETCH-LOGICAL-c469t-d2089466fde155969725ecdff9bbf19c0c3213c0c1e84c02523884667bfc88e53</originalsourceid><addsrcrecordid>eNqFkE1P3DAQhnMoEp8_oZLVAyqq0h07iXFOCFaFVlqB1I_zKHHGwdusvdhJF_j1NeyKK76MZD_vzPjJso8cvnLgcvaLAxS5LIT8DOpMAogyFx-yg7fr_ewwxiVAWUrJD7KfV9511vVsRfq-cTaumDdsGsbQRO-sZhvqemLtjkpv2q_XFNjGBmLesctpdmtn84nFqY0pNdJxtmeaIdLJrh5lf66__Z5_zxd3Nz_ml4tcl7Ie806AqtMSpiNeVbWsz0VFujOmblvDaw26ELxIhZMqNYhKFEol_rw1WimqiqPsy7bvpnGmcT0u_RRcmojP_VNcxscWSQAo4ElCok-39Dr4h4niiCsbNQ1D48hPEQshFE8ngdUW1MHHGMjgOthVE56QA744xlfH-CITQeGrYxQpd7HNUfrzP0sBo7bkNHXJlB6x8_bdDp92k--96x-Sb2wb_dfYgVBIWdVQlcV_4vGQFQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>32281111</pqid></control><display><type>article</type><title>Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate</title><source>Elsevier ScienceDirect Journals Complete</source><source>Alma/SFX Local Collection</source><creator>田艳红 王春青 Y. Norman ZHOU</creator><creatorcontrib>田艳红 王春青 Y. Norman ZHOU</creatorcontrib><description>The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.</description><identifier>ISSN: 1003-6326</identifier><identifier>DOI: 10.1016/S1003-6326(08)60024-2</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>bonding mechanism ; copper wire ; ultrasonic wedge bonding ; wear action ; 磨损性能 ; 超声波焊接 ; 金属学 ; 铜导线</subject><ispartof>Transactions of Nonferrous Metals Society of China, 2008-02, Vol.18 (1), p.132-137</ispartof><rights>2008 The Nonferrous Metals Society of China</rights><rights>Copyright © Wanfang Data Co. Ltd. All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c469t-d2089466fde155969725ecdff9bbf19c0c3213c0c1e84c02523884667bfc88e53</citedby><cites>FETCH-LOGICAL-c469t-d2089466fde155969725ecdff9bbf19c0c3213c0c1e84c02523884667bfc88e53</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://image.cqvip.com/vip1000/qk/85276X/85276X.jpg</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/S1003-6326(08)60024-2$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>田艳红 王春青 Y. Norman ZHOU</creatorcontrib><title>Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate</title><title>Transactions of Nonferrous Metals Society of China</title><addtitle>Transactions of Nonferrous Metals Society of China</addtitle><description>The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.</description><subject>bonding mechanism</subject><subject>copper wire</subject><subject>ultrasonic wedge bonding</subject><subject>wear action</subject><subject>磨损性能</subject><subject>超声波焊接</subject><subject>金属学</subject><subject>铜导线</subject><issn>1003-6326</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNqFkE1P3DAQhnMoEp8_oZLVAyqq0h07iXFOCFaFVlqB1I_zKHHGwdusvdhJF_j1NeyKK76MZD_vzPjJso8cvnLgcvaLAxS5LIT8DOpMAogyFx-yg7fr_ewwxiVAWUrJD7KfV9511vVsRfq-cTaumDdsGsbQRO-sZhvqemLtjkpv2q_XFNjGBmLesctpdmtn84nFqY0pNdJxtmeaIdLJrh5lf66__Z5_zxd3Nz_ml4tcl7Ie806AqtMSpiNeVbWsz0VFujOmblvDaw26ELxIhZMqNYhKFEol_rw1WimqiqPsy7bvpnGmcT0u_RRcmojP_VNcxscWSQAo4ElCok-39Dr4h4niiCsbNQ1D48hPEQshFE8ngdUW1MHHGMjgOthVE56QA744xlfH-CITQeGrYxQpd7HNUfrzP0sBo7bkNHXJlB6x8_bdDp92k--96x-Sb2wb_dfYgVBIWdVQlcV_4vGQFQ</recordid><startdate>20080201</startdate><enddate>20080201</enddate><creator>田艳红 王春青 Y. Norman ZHOU</creator><general>Elsevier Ltd</general><general>State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology,Harbin 150001, China%Microjoining Laboratory, Center for Advanced Materials Joining, University of Waterloo,Waterloo, Canada, N2L 3G1</general><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>2B.</scope><scope>4A8</scope><scope>92I</scope><scope>93N</scope><scope>PSX</scope><scope>TCJ</scope></search><sort><creationdate>20080201</creationdate><title>Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate</title><author>田艳红 王春青 Y. Norman ZHOU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c469t-d2089466fde155969725ecdff9bbf19c0c3213c0c1e84c02523884667bfc88e53</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>bonding mechanism</topic><topic>copper wire</topic><topic>ultrasonic wedge bonding</topic><topic>wear action</topic><topic>磨损性能</topic><topic>超声波焊接</topic><topic>金属学</topic><topic>铜导线</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>田艳红 王春青 Y. Norman ZHOU</creatorcontrib><collection>中文科技期刊数据库</collection><collection>中文科技期刊数据库-CALIS站点</collection><collection>中文科技期刊数据库-7.0平台</collection><collection>中文科技期刊数据库-工程技术</collection><collection>中文科技期刊数据库- 镜像站点</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Wanfang Data Journals - Hong Kong</collection><collection>WANFANG Data Centre</collection><collection>Wanfang Data Journals</collection><collection>万方数据期刊 - 香港版</collection><collection>China Online Journals (COJ)</collection><collection>China Online Journals (COJ)</collection><jtitle>Transactions of Nonferrous Metals Society of China</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>田艳红 王春青 Y. Norman ZHOU</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate</atitle><jtitle>Transactions of Nonferrous Metals Society of China</jtitle><addtitle>Transactions of Nonferrous Metals Society of China</addtitle><date>2008-02-01</date><risdate>2008</risdate><volume>18</volume><issue>1</issue><spage>132</spage><epage>137</epage><pages>132-137</pages><issn>1003-6326</issn><abstract>The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/S1003-6326(08)60024-2</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1003-6326 |
| ispartof | Transactions of Nonferrous Metals Society of China, 2008-02, Vol.18 (1), p.132-137 |
| issn | 1003-6326 |
| language | eng |
| recordid | cdi_wanfang_journals_zgysjsxb_e200801024 |
| source | Elsevier ScienceDirect Journals Complete; Alma/SFX Local Collection |
| subjects | bonding mechanism copper wire ultrasonic wedge bonding wear action 磨损性能 超声波焊接 金属学 铜导线 |
| title | Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T11%3A37%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-wanfang_jour_proqu&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Bonding%20mechanism%20of%20ultrasonic%20wedge%20bonding%20of%20copper%20wire%20on%20Au/Ni/Cu%20substrate&rft.jtitle=Transactions%20of%20Nonferrous%20Metals%20Society%20of%20China&rft.au=%E7%94%B0%E8%89%B3%E7%BA%A2%20%E7%8E%8B%E6%98%A5%E9%9D%92%20Y.%20Norman%20ZHOU&rft.date=2008-02-01&rft.volume=18&rft.issue=1&rft.spage=132&rft.epage=137&rft.pages=132-137&rft.issn=1003-6326&rft_id=info:doi/10.1016/S1003-6326(08)60024-2&rft_dat=%3Cwanfang_jour_proqu%3Ezgysjsxb_e200801024%3C/wanfang_jour_proqu%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=32281111&rft_id=info:pmid/&rft_cqvip_id=26659054&rft_wanfj_id=zgysjsxb_e200801024&rft_els_id=S1003632608600242&rfr_iscdi=true |